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| 型號(hào)： | MPC740PRX366LE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 366 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁(yè)數(shù)： | 11/24頁(yè) |
| 文件大?。?/td> | 543K |
| 代理商： | MPC740PRX366LE |
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XPC750P RISC Microprocessor Hardware Specications
19
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Package Description
Package outline
25 x 25 mm
Interconnects
360 (19 x 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.65 mm
Maximum module height
3.20 mm
Ball diameter
0.89 mm (35 mil)
1.7.4 Mechanical Dimensions of the XPC750P
Figure 10. provides the mechanical dimensions and bottom surface nomenclature of the XPC750P, 360
CBGA package.
Figure 10. Mechanical Dimensions and Bottom Surface Nomenclature of the XPC750P
Notes:
1. Dimensioning and tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is the maximum solder
ball diameter measured parallel to
datum A.
4.D2 and E2 dene the area occupied by
the die and underll. Actual size of this
area may be smaller than shown. D3
and E3 are the minimum clearance
from the package edge to the chip
capacitors.
5. Capacitors may not be present on all
devices.
6. Caution must be taken not to short
A1
Millimeters
DIM
Min
Max
A
2.72
3.20
A1
0.80
1.00
A2
1.10
1.30
A3
--
0.60
A4
0.82
0.90
b
0.82
0.93
D
25.00 BSC
D1
22.86 BSC
D2
--
12.50
D3
2.75
--
D4
6.00
9.00
e
1.27 BSC
E
25.00 BSC
E1
22.86 BSC
E2
--
14.30
E3
3.00
--
E4
8.00
11.00
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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