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參數(shù)資料
| 型號(hào)： | MPC740PRX333LE |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 333 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 9/24頁 |
| 文件大?。?/td> | 543K |
| 代理商： | MPC740PRX333LE |
XPC750P RISC Microprocessor Hardware Specications
17
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Pin Assignments
Figure 8. shows the L2 bus output timing diagrams for the XPC750P.
Figure 8. L2 Bus Output Timing Diagrams
1.4.3 IEEE 1149.1 AC Timing Specications
This section is unchanged from the MPC750 Hardware Specication; refer to that document for this
information.
1.5 Pin Assignments
This section is unchanged from the MPC750 Hardware Specication; refer to that document for this
information.
1.6 Pinout Listings
This section is unchanged from the MPC750 Hardware Specication; refer to that document for this
information.
1.7 Package Description
The following sections provide the package parameters and mechanical dimensions for the XPC740P, 255
CBGA packages.
1.7.1 Parameters for the XPC740P
The package parameters are as provided in the following list. The package type is 21 x 21 mm, 255-lead
ceramic ball grid array (CBGA).
Package outline
21 x 21 mm
Interconnects
255 (16 x 16 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.45 mm
27
VM
VM = Midpoint Voltage (1.4V)
L2SYNC_IN
26
ALL OUTPUTS
VM
28
L2DATA BUS
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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