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參數(shù)資料
| 型號： | MPC603RZT300TA |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 24/36頁 |
| 文件大小： | 440K |
| 代理商： | MPC603RZT300TA |
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PID7t-603e Hardware Specifications
System Design Information
Figure 17. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Internet: www.dow.com
Chomerics, Inc.
781-935-4850
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
Thermagon Inc.
888-246-9050
3256 West 25th Street
Cleveland, OH 44109-1668
Internet: www.thermagon.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
Specific
Thermal
Resistance
(Kin
2
/W)
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