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參數(shù)資料
| 型號： | MPC603RZT300LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA255 |
| 封裝： | 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 |
| 文件頁數(shù)： | 18/36頁 |
| 文件大?。?/td> | 440K |
| 代理商： | MPC603RZT300LX |
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PID7t-603e Hardware Specifications
25
System Design Information
1.8.5 Pull-up Resistor Requirements
The 603e requires high-resistive (weak: 10 K
W) pull-up resistors on several control signals of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the 603e or other bus master. These signals areTS, ABB, DBB, and ARTRY.
In addition, the 603e has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
W10 KW) if they are used by the system. These signals areAPE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 K
W) pull-up
resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
areA[031], AP[03], TT[04], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management information for the CBGA and PBGA packages for air-cooled
applications. Proper thermal control design is primarily dependent upon the system-level designthe heat
sink, airow and thermal interface material.
Figure 14 shows the upper and lower limits of the die junction-to-ambient thermal resistance for both
package styles. The lower limit is shown for the case of a densely populated printed-circuit board with high
thermal loading of adjacent and neighboring components.
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