參數資料
型號: MPC603RZT266TX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA255
封裝: 23 X 23 MM, 2.60 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
文件頁數: 13/36頁
文件大?。?/td> 440K
代理商: MPC603RZT266TX
20
PID7t-603e Hardware Specifications
Package Descriptions
1.7.2 PBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the PBGA package.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 23 mm x 23 mm, 255-lead
plastic ball grid array (PBGA).
Package outline
23 mm x 23 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Package height
Minimum: 2.1 mm
Maximum: 2.6 mm
Ball diameter
0.76 mm (30 mil)
Maximum heat sink force
5 lbs
相關PDF資料
PDF描述
MPC603RZT133LX 32-BIT, 133 MHz, RISC PROCESSOR, PBGA255
MPC603RRX166TX 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255
MPC603RRX233LX 32-BIT, 233 MHz, RISC PROCESSOR, CBGA255
MPC603RRX100LX 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
MPC603RRX133LX 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
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