參數(shù)資料
型號(hào)： MPC603RRX300TX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 18/36頁(yè)
文件大?。?/td> 451K
代理商： MPC603RRX300TX
PID7t-603e Hardware Specifications
25
System Design Information
1.8.5 Pull-up Resistor Requirements
The 603e requires high-resistive (weak: 10 K
W) pull-up resistors on several control signals of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the 603e or other bus master. These signals areTS, ABB, DBB, and ARTRY.
In addition, the 603e has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
W10 KW) if they are used by the system. These signals areAPE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 K
W) pull-up
resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
areA[031], AP[03], TT[04], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management information for the CBGA and PBGA packages for air-cooled
applications. Proper thermal control design is primarily dependent upon the system-level designthe heat
sink, airow and thermal interface material.
Figure 14 shows the upper and lower limits of the die junction-to-ambient thermal resistance for both
package styles. The lower limit is shown for the case of a densely populated printed-circuit board with high
thermal loading of adjacent and neighboring components.
相關(guān)PDF資料
PDF描述
MPC603RRX200LX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPC603RRX200TX 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
MPC603RRX266TX 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
MPC603EZT200LX 32-BIT, 200 MHz, RISC PROCESSOR, PBGA255
MPC603EZT200TX 32-BIT, 200 MHz, RISC PROCESSOR, PBGA255
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC603RVG200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RVG300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RZT200LC 功能描述:微處理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC604E 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary
MPC6071 制造商:International Rectifier 功能描述:
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*