參數(shù)資料
型號： MPC603RRX266TX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù)： 25/36頁
文件大小： 451K
代理商： MPC603RRX266TX
PID7t-603e Hardware Specifications
31
System Design Information
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067-3910
Internet: www.loctite.com
1.8.6.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (qjc + qint + qsa) * Pd
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
qjc is the die junction-to-case thermal resistance
qint is the adhesive or interface material thermal resistance
qsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specied in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30 to 40 C. The air temperature rise within a cabinet (Tr) may be in the
range of 5 to 10 C. The thermal resistance of the thermal interface material (
qint) is typically about 1 C/W.
Assuming a Ta of 30 C, a Tr of 5 C a CBGA package qjc = 0.095, and a power consumption (Pd) of 3.0
Watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 C + 5 C + (0.095 C/W + 1.0 C/W + Rsa) * 3.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (Rsa) versus airow
velocity is shown in Figure 18.
相關(guān)PDF資料
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MPC603RRX266TX 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255
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MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RVG200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RVG300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RZT200LC 功能描述:微處理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC604E 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary
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