參數(shù)資料
型號: MPC603ERX133TX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 133 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù): 1/32頁
文件大?。?/td> 149K
代理商: MPC603ERX133TX
MPC603EEC/D
(Motorola Order Number)
5/1999
Rev. 2
G522-0268-00
(IBM Order Number)
The PowerPC name, the PowerPC logotype, PowerPC 603, and PowerPC 603e are trademarks of International Business Machines Corporation,
used by Motorola under license from International Business Machines Corporation. FLOTHERM is a registered trademark of Flomerics Ltd., UK
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
Motorola Inc., 1999. All rights reserved.
Portions hereof International Business Machines Corporation, 1991–1999. All rights reserved.
change or discontinue this product without notice.
Advance Information
PowerPC 603e RISC Microprocessor Family:
PID6-603e Hardware Specications
The PowerPC 603e microprocessor is an implementation of the PowerPC family of
reduced instruction set computing (RISC) microprocessors. In this document, the term
‘603e’ is used as an abbreviation for the phrase, ‘PowerPC 603e microprocessor’. The
PowerPC 603e microprocessors are available from Motorola as MPC603e and from IBM
as PPC603e.
Note that the 603e is implemented in both a 2.5-volt version (PID 0007t PowerPC 603e
microprocessor, abbreviated as PID7t-603e) and a 3.3-volt version (PID 0006 PowerPC
603e microprocessor, abbreviated as PID6-603e). This document describes the pertinent
physical characteristics of the PID6-603e. For functional characteristics of the processor,
refer to the PowerPC 603e RISC Microprocessor Users Manual.
This document contains the following topics:
Topic
Page
Section 1.1, “Overview”
2
Section 1.2, “Features”
3
Section 1.3, “General Parameters”
4
Section 1.4, “Electrical and Thermal Characteristics”
4
Section 1.5, “PowerPC 603e Microprocessor Pin Assignments”
14
Section 1.6, “PowerPC 603e Microprocessor Pinout Listings”
16
Section 1.7, “PowerPC 603e Microprocessor Package Description”
20
Section 1.8, “System Design Information”
24
Section 1.10, “Ordering Information”
31
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相關代理商/技術參數(shù)
參數(shù)描述
MPC603RRX200LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX200TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX266TC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC603RRX300LC 功能描述:微處理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324