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參數(shù)資料
| 型號： | MPC603EFE100LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件頁數(shù)： | 24/32頁 |
| 文件大小： | 149K |
| 代理商： | MPC603EFE100LX |
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PID6-603e Hardware Specifications, Rev 2
Figure 17. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30°C + 5°C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 4.5 W,
resulting in a die-junction temperature of approximately 81 °C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
gure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat ow. The nal die-junction
operating temperature, is not only a function of the component-level thermal resistance, but the system-level
design and its operating conditions. In addition to the component's power consumption, a number of factors
affect the nal operating die-junction temperature—airow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several “compact”
thermal-package models are available within FLOTHERM. These are available upon request.
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0
0.5
1
1.5
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3.5
Thermalloy #2328B Pin-fin Heat Sink
(25 x 28 x 15 mm)
Heat
Sink
Thermal
Resistance
(
°C/W)
Approach Airflow Velocity
(m/s)
Approach Airflow Velocity (m/s)
Heat
Sink
Thermal
Resistance
(°C/W)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC603EFE100TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603EFE133LN | 制造商:Motorola Inc 功能描述: |
| MPC603EFE133TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX100LN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX100TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
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