參數(shù)資料
型號(hào)： MPC5602PEFMLQ
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROCONTROLLER, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144
文件頁(yè)數(shù)： 22/72頁(yè)
文件大?。?/td> 661K
代理商： MPC5602PEFMLQ
MPC560xP Datasheet Data Sheet, Rev. 1
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
29
3.3.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:
TJ = TA + (RθJA * PD)
Eqn. 1
where:
TA
= ambient temperature for the package (oC)
RθJA
= junction to ambient thermal resistance (oC/W)
PD
= power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
Table 9. Thermal Characteristics for 100-pin LQFP1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
No.
Symbol
Parameter
Conditions
Value Unit
1RθJA
CC Thermal resistance junction-to-ambient
natural convection2
2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board - 1s
TBD °C/W
2RθJMA CC Thermal resistance junction-to-ambient
natural convection2
Four layer board - 2s2p
TBD °C/W
3RθJA
CC Thermal resistance junction-to-ambient2
@ 200 ft./min., single layer board
TBD °C/W
4RθJMA CC Thermal resistance junction-to-ambient
@ 200 ft./min., four layer board 2s2p
TBD °C/W
5RθJB
CC Thermal resistance junction to board3
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
TBD °C/W
6RθJC
CC Thermal resistance junction to case4
4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
TBD °C/W
7
Ψ
JT
CC Junction to package top natural convection5
5 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
TBD °C/W
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