參數(shù)資料
型號(hào)： MPC5602DF1CLL4
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 48 MHz, MICROCONTROLLER, PQFP100
封裝： 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-100
文件頁(yè)數(shù)： 37/83頁(yè)
文件大?。?/td> 1473K
代理商： MPC5602DF1CLL4
MPC5602D Microcontroller Data Sheet, Rev. 4
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
42
4.11
Flash memory electrical characteristics
The data flash operation depends strongly on the code flash operation. If code flash is switched-off, the data flash is disabled.
4.11.1
Program/Erase characteristics
Table 26 shows the program and erase characteristics.
IDDSTDBY
CC P STANDBY mode current9 Slow internal RC oscillator
(128 kHz) running
TA = 25 °C
—
30
100
A
DTA =55°C
—
75
—
DTA = 85 °C
—
180
700
DTA = 105 °C
—
315
1000
PTA = 125 °C
—
560
1700
1 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
2 Running consumption does not include I/Os toggling which is highly dependent on the application. The given value
is thought to be a worst case value with all peripherals running, and code fetched from code flash while modify
operation ongoing on data flash. Notice that this value can be significantly reduced by application: switch off not used
peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used functions,
use low power mode when possible.
3 Higher current may be sinked by device during power-up and standby exit. Please refer to in-rush average current on
4 RUN current measured with typical application with accesses on both flash memory and SRAM.
5 Only for the “P” classification: Code fetched from SRAM: serial IPs CAN and LIN in loop-back mode, DSPI as Master,
PLL as system clock (3 × Multiplier) peripherals on (eMIOS/CTU/ADC) and running at maximum frequency, periodic
SW/WDG timer reset enabled.
6 Data flash power down. Code flash in low power. SIRC (128 kHz) and FIRC (16 MHz) on. 10 MHz XTAL clock.
FlexCAN: 0 ON (clocked but no reception or transmission). LINFlex: instances: 0, 1, 2 ON (clocked but no reception
or transmission), instance: 3 clocks gated. eMIOS: instance: 0 ON (16 channels on PA[0]–PA[11] and PC[12]–PC[15])
with PWM 20 kHz, instance: 1 clock gated. DSPI: instance: 0 (clocked but no communication). RTC/API ON.PIT ON.
STM ON. ADC ON but no conversion except 2 analog watchdogs.
7 Only for the “P” classification: No clock, FIRC (16 MHz) off, SIRC (128 kHz) on, PLL off, HPVreg off,
ULPVreg/LPVreg on. All possible peripherals off and clock gated. Flash in power down mode.
8 When going from RUN to STOP mode and the core consumption is > 6 mA, it is normal operation for the main
regulator module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction
temperatures exceeding 125 °C and under these circumstances, it is possible for the current to initially exceed the
maximum STOP specification by up to 2 mA. After entering stop, the application junction temperature will reduce to
the ambient level and the main regulator will be automatically switched off when the load current is below 6 mA.
9 Only for the “P” classification: ULPVreg on, HP/LPVreg off, 16 KB SRAM on, device configured for minimum
consumption, all possible modules switched off.
Table 25. Power consumption on VDD_BV and VDD_HV (continued) (continued)
Symbol
C
Parameter
Conditions1
Value
Unit
Min
Typ
Max
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