參數(shù)資料
型號(hào)： MPC5561MZQ132R
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： MICROCONTROLLER, PBGA324
封裝： 23 X 23 MM, 1 MM PITCH, MS-034AAJ-1, TEPBGA-324
文件頁數(shù)： 9/56頁
文件大?。?/td> 1044K
代理商： MPC5561MZQ132R
Electrical Characteristics
MPC5561 Microcontroller Data Sheet, Rev. 2.0
Freescale Semiconductor
17
Figure 3 shows an approximate interpolation of the ISTBY worst-case specification to estimate values at
different voltages and temperatures. The vertical lines shown at 25 οC, 60 οC, and 150 οC in Figure 3 are
the IDD_STBY specifications (27d) listed in Table 9.
Figure 3. ISTBY Worst-case Specifications
3.8.1
I/O Pad Current Specifications
The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The
power consumption is the sum of all output pin currents for a segment. The output pin current can be
calculated from Table 10 based on the voltage, frequency, and load on the pin. Use linear scaling to
calculate pin currents for voltage, frequency, and load parameters that fall outside the values given in
Table 10. I/O Pad Average DC Current (TA = TL – TH)
1
Spec
Pad Type
Symbol
Frequency
(MHz)
Load2 (pF)
Voltage (V)
Drive Select /
Slew Rate
Control Setting
Current (mA)
1
Slow
IDRV_SH
25
50
5.25
11
8.0
210
50
5.25
01
3.2
3
2
50
5.25
00
0.7
4
2
200
5.25
00
2.4
Istby vs. Junction Tem p
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Tem p (C)
uA
0.8V
1.0V
1.2V
A
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