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參數資料
| 型號： | MPC5554MVR112 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA416 |
| 封裝： | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 |
| 文件頁數： | 53/54頁 |
| 文件大小： | 841K |
| 代理商： | MPC5554MVR112 |
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MPC5554 Microcontroller Data Sheet, Rev. 3.0
Electrical Characteristics
Freescale Semiconductor
8
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5554 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
—
1000
MHz
2
Operating frequency
—
fMAX
MHz
3VDD operating voltages
—
1.5
—
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
—
3.3
—
V
5VPP, VDDEH, VDDA operating voltages
—
5.0
—
V
6
Maximum amplitude
—
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
—
25
oC
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MPC5554MVR132 | 功能描述:32位微控制器 - MCU MPC5554 COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數據總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數據 RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風格:SMD/SMT |
| MPC5554MVR132R2 | 功能描述:32位微控制器 - MCU COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數據總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數據 RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風格:SMD/SMT |
| MPC5554MVR80 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Trays |
| MPC5554MVR80R2 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Tape and Reel |
| MPC5554MZP112 | 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Trays |
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