參數(shù)資料
型號(hào): MPC5554MVR112
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA416
封裝: 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416
文件頁數(shù): 51/54頁
文件大?。?/td> 841K
代理商: MPC5554MVR112
MPC5554 Microcontroller Data Sheet, Rev. 3.0
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J
, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature for the package (
oC)
RθJA = junction to ambient thermal resistance (
oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
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MPC5554MVR132R2 功能描述:32位微控制器 - MCU COPPERHEAD Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
MPC5554MVR80 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Trays
MPC5554MVR80R2 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Tape and Reel
MPC5554MZP112 制造商:Freescale Semiconductor 功能描述:MCU 32BIT 55XX RISC 2MB FLASH 1.8V/2.5V/3.3V/5V 416BGA - Trays