- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45337 > MPC5553MVR112 (FREESCALE SEMICONDUCTOR INC) 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA416 PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC5553MVR112 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA416 |
| 封裝： | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 |
| 文件頁數(shù)： | 66/68頁 |
| 文件大?。?/td> | 1261K |
| 代理商： | MPC5553MVR112 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁當(dāng)前第66頁第67頁第68頁
Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 3.0
Freescale Semiconductor
7
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RθJB × PD)
where:
TJ = junction temperature (
oC)
TB = board temperature at the package perimeter (
oC/W)
RθJB = junction-to-board thermal resistance (
oC/W) per JESD51-8
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value
for the junction temperature is predictable. Ensure the application board is similar to the thermal test
condition, with the component soldered to a board with internal planes.
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a
case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (
oC/W)
RθJC = junction-to-case thermal resistance (
oC/W)
RθCA = case-to-ambient thermal resistance (
oC/W)
RθJC is device related and is not affected by other factors. The thermal environment can be controlled to
change the case-to-ambient thermal resistance, RθCA. For example, change the air flow around the device,
add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal
Because
of
an
order
from
the
United
States
International
Trade
Commission,
BGA-packaged
product
lines
and
part
numbers
indicated
here
currently
are
not
available
from
Freescale
for
import
or
sale
in
the
United
States
prior
to
September
2010:
MPC551x
and
MPC5533
products
in
208
MAPBGA
packages;
MPC5534
and
MPC5553
products
in
208
and
496
MAPBGA
packages;
MPC5554,
MPC5565,
MPC5566
and
MPC5567
products
in
496
MAPBGA
packages
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC5554MVR112R2 | MICROCONTROLLER, PBGA416 |
| MPC5554AVR132R2 | MICROCONTROLLER, PBGA416 |
| MPC5554MZP80R2 | 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PBGA416 |
| MPC5554AVR132 | 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416 |
| MPC5554MVR112 | 32-BIT, FLASH, 112 MHz, MICROCONTROLLER, PBGA416 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5553MVR112R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVR132 | 功能描述:32位微控制器 - MCU MOCCASIN REVA Qorivva RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:90 MHz 程序存儲(chǔ)器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MPC5553MVR132R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5553MVR80 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller Data Sheet |
| MPC5553MVR80R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。