- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄10943 > MPC5534MZQ80 (Freescale Semiconductor)MCU 1MB FLASH 80MHZ 324-PBGA PDF資料下載
參數(shù)資料
| 型號： | MPC5534MZQ80 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 45/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 1MB FLASH 80MHZ 324-PBGA |
| 標準包裝： | 60 |
| 系列： | MPC55xx Qorivva |
| 核心處理器： | e200z6 |
| 芯體尺寸： | 32-位 |
| 速度： | 80MHz |
| 連通性： | CAN，EBI/EMI，以太網(wǎng)，SCI，SPI |
| 外圍設備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 192 |
| 程序存儲器容量： | 1MB（1M x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 64K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.35 V ~ 1.65 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 40x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 324-BBGA |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁當前第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁
Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
5
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
28
Maximum solder temperature 11
Lead free (Pb-free)
Leaded (SnPb)
TSDR
—
260.0
245.0
oC
29
Moisture sensitivity level 12
MSL
—
3
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.
3 All functional non-supply I/O pins are clamped to V
SS and VDDE, or VDDEH.
4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.
7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.
8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9 Total injection current for all analog input pins must not exceed 15 mA.
10 Lifetime operation at these specification limits is not guaranteed.
11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12 Moisture sensitivity per JEDEC test method A112.
Table 3. MPC5534 Thermal Characteristic
Spec
MPC5534 Thermal Characteristic
Symbol
Package
Unit
208
MAPBGA
324
PBGA
1
Junction to ambient 1, 2, natural convection (one-layer board)
1 Junction temperature is a function of: on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board in a horizontal position.
RJA
42
34
°C/W
2
Junction to ambient 1, 3, natural convection (four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board in a horizontal position.
RJA
26
23
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
34
28
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
22
20
°C/W
5
Junction to board 4 (four-layer board 2s2p)
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
15
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
810
°C/W
7
Junction to package top 6, natural convection
JT
22
°C/W
Table 2. Absolute Maximum Ratings 1 (continued)
Spec
Characteristic
Symbol
Min.
Max.
Unit
相關PDF資料 |
PDF描述 |
|---|---|
| VE-B3F-IW-B1 | CONVERTER MOD DC/DC 72V 100W |
| VE-B33-IW-B1 | CONVERTER MOD DC/DC 24V 100W |
| MC9328MX21SCVK | IC MCU I.MX21 266MHZ 289-MAPBGA |
| MCF54415CMJ250 | IC MCU 32BIT 256MAPBGA |
| VE-B32-IX-B1 | CONVERTER MOD DC/DC 15V 75W |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC5534MZQ80R2 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC555 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:This document provides an overview of the MPC555 microcontroller, including a block diagram showing the major modular components and sections that lis |
| MPC5553 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller Data Sheet |
| MPC5553_07 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller Data Sheet |
| MPC5553AVF112 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller |
發(fā)布緊急采購，3分鐘左右您將得到回復。