參數(shù)資料
型號(hào)： MPC107APX100L0
廠商： MOTOROLA INC
元件分類： 外設(shè)及接口
英文描述： MULTIFUNCTION PERIPHERAL, PPGA503
封裝： PLASTIC, BGA-503
文件頁(yè)數(shù)： 5/46頁(yè)
文件大?。?/td> 585K
代理商： MPC107APX100L0
MPC107 Hardware Specifications (Rev 0.2)
13
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
Electrical and Thermal Characteristics
1.4.2 Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC107.
1.4.3 AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC107. After fabrication, functional parts
are sorted by maximum core frequency as shown in Table 7 and Section 1.4.3.1, Clock AC Specications
and tested for conformance to the AC specications for that frequency. The core frequency is determined by
the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[03] signals. Parts are sold by
maximum processor core frequency; see Section 1.9, Ordering Information.
Table 7 provides the operating frequency information for the MPC107.
Table 6. PBGA Package Thermal Characteristics
Characteristic
Symbols
Value
Units
Die Junction-to-Case Thermal Resistance
qJC
< 0.1
C/W
Die Junction-to-Board Thermal Resistance
qJB
5.2
C/W
Package Junction-to-Ambient Thermal Resistance2
qJA
Notes:
1. Refer to Section 1.7, System Design Information for more details about thermal
management
.
2. TJ = TA + PD x qJA
TJ = Die junction temperature.
TA = System air ambient temperature near the package.
PD = Average power consumed by IC in Watts.
qJA = Thermal resistance from die junction to ambient air in C/W
Table 7. Operating Frequency
At recommended operating conditions (See Table 2) with GVdd = 3.3 V ± 5% and LVdd = 3.3 V ± 5%
Characteristic1
66 MHz
100 MHz
Units
Min
Max
Min
Max
Core (memory bus/processor bus) frequency
25
66
25
100
MHz
PCI input frequency (PCI_SYNC_IN)
12.566
MHz
Notes:
Caution: The PCI_SYNC_IN frequency and PLL_CFG[03] settings must be chosen such that the resulting
peripheral logic/ memory bus frequency, CPU (core) frequency, and PLL (VCO) frequencies do not exceed
their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[03] signal description
in Section 1.6, PLL Conguration for valid PLL_CFG[03] settings and PCI_SYNC_IN frequencies.
相關(guān)PDF資料
PDF描述
MPC184VFB SPECIALTY MICROPROCESSOR CIRCUIT, PBGA252
MPC5123YVY400BR RISC PROCESSOR, PBGA516
MPC5123VY400B RISC PROCESSOR, PBGA516
MPC5123VY400BR RISC PROCESSOR, PBGA516
MPC5125YVN200 32-BIT, FLASH, 200 MHz, MICROCONTROLLER, PBGA324
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC-108 制造商:Greenlee Textron Inc 功能描述:Unspecified Tools & Accessories ADAPTER,MATING BULKHEAD
MPC108100J 功能描述:厚膜電阻器 - 透孔 MPC10 10R 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk
MPC108101J 制造商:TE Connectivity 功能描述:RESISTOR 10 WATT 100R 5%
MPC108102J 功能描述:厚膜電阻器 - 透孔 MPC10 1K0 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk
MPC108103J 功能描述:厚膜電阻器 - 透孔 MPC10 10K 5% RoHS:否 制造商:Caddock 電阻:27 kOhms 容差:1 % 功率額定值:8 W 溫度系數(shù):50 PPM / C 系列:MS 端接類型:Axial 電壓額定值:2 kV 工作溫度范圍:- 15 C to + 275 C 尺寸:8.89 mm Dia. x 23.11 mm L 封裝:Bulk
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*