參數(shù)資料
型號： mobile pentium II
廠商： Intel Corp.
英文描述： pentium II processor Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz,333 MHz, 300PE MHz, AND 266PE MHz(工作頻率400,366,333,300PE和266PE兆赫茲微PGA和BGA封裝奔II處理器)
中文描述： 奔騰II處理器的微PGA和BGA封裝在400兆赫，366兆赫，333兆赫，300PE MHz和266PE兆赫（工作頻率400366333300體育和266PE兆赫茲微美國PGA和BGA封裝封裝奔二處理器）
文件頁數(shù)： 1/81頁
文件大?。?/td> 593K
代理商： MOBILE PENTIUM II
INTEL CORPORATION
ORDER NUMBER: 245103-003
MOBILE PENTIUM II PROCESSOR IN
Micro-PGA AND BGA PACKAGES AT 400 MHz, 366 MHz,
333 MHz, 300PE MHz, AND 266PE MHz
Available at 400 MHz, 366 MHz, 333 MHz,
300PE MHz, and 266PE MHz
Supports the Intel Architecture with
Dynamic Execution
Integrated primary 16-Kbyte instruction
cache and 16-Kbyte write back data cache
Integrated second level cache (256-Kbyte)
Micro-PGA and BGA packaging
technologies
— Supports thin form factor notebook
designs
— Exposed die enables more efficient heat
dissipation
Fully compatible with previous Intel
microprocessors
— Binary compatible with all applications
— Support for MMX technology
Power Management Features
— Quick Start and Deep Sleep modes
provide extremely low power
dissipation
Low-Power GTL+ processor system bus
interface
Integrated math co-processor
Integrated thermal diode
The Intel Mobile Pentium II processor introduces a higher level of performance for today’s mobile
computing environment, including multimedia enhancements and improved Internet and communications
capabilities. It provides an improved performance
available for applications running on advanced operating
systems such as Windows* 98. On top of its built-in power management capabilities, the Pentium II
processor takes advantage of software designed for Intel’s MMX technology to unleash enhanced color,
smoother graphics and other multimedia and communications enhancements.
The Mobile Pentium II processor may contain design defects or errors know as errata that may cause the
product to deviate from published specifications. Current characterized errata are available upon request.
1.
Refer to the Mobile Pentium II Processor Performance Brief
.
相關(guān)PDF資料
PDF描述
MOBILE PENTIUM II cpu Pentium II processor in Mini-Cartridge Package at 400 MHZ, 366 MHZ,333 MHz, 300PE MHz, And 266PE MHz(工作頻率400,366,333,300PE和266PE兆赫茲小彈筒封裝奔II處理器)
mobile pentium processor 32 Bir CPU with MMX Technology(32 位帶MMX技術(shù)處理器)
MOC3040 ECONOLINE: RSS & RSD - 1kVDC and 3KVDC Isolation- Internal SMD Construction- UL94V-0 Package Material- Toroidal Magnetics- Efficiency to 85%- SMD5, SMD8, SMD10 and SMD12 case styles
MOC3040X OPTICALLY COUPLED BILATERAL SWITCH LIGHT ACTIVATED ZERO VOLTAGE CROSSING TRIAC
MOSFETIRF6602 DirectFET⑩ Power MOSFET(Vdss=20V)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MOBP01-SR1 功能描述:PROGRAMMER FLASH 49K/77G/78A RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 過時/停產(chǎn)零件編號 系列:- 標準包裝:1 系列:- 類型:MCU 適用于相關(guān)產(chǎn)品:Freescale MC68HC908LJ/LK（80-QFP ZIF 插口） 所含物品:面板、纜線、軟件、數(shù)據(jù)表和用戶手冊 其它名稱:520-1035
MOBZ 制造商:MMD 制造商全稱:MMD Components 功能描述:Oven Controlled Oscillator
MOC119 功能描述:晶體管輸出光電耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 輸入類型:DC 最大集電極/發(fā)射極電壓:70 V 最大集電極/發(fā)射極飽和電壓:0.4 V 絕緣電壓:5300 Vrms 電流傳遞比:100 % to 200 % 最大正向二極管電壓:1.65 V 最大輸入二極管電流:60 mA 最大集電極電流:100 mA 最大功率耗散:100 mW 最大工作溫度:+ 110 C 最小工作溫度:- 55 C 封裝 / 箱體:DIP-4 封裝:Bulk
MOC119_Q 功能描述:晶體管輸出光電耦合器 Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 輸入類型:DC 最大集電極/發(fā)射極電壓:70 V 最大集電極/發(fā)射極飽和電壓:0.4 V 絕緣電壓:5300 Vrms 電流傳遞比:100 % to 200 % 最大正向二極管電壓:1.65 V 最大輸入二極管電流:60 mA 最大集電極電流:100 mA 最大功率耗散:100 mW 最大工作溫度:+ 110 C 最小工作溫度:- 55 C 封裝 / 箱體:DIP-4 封裝:Bulk
MOC119300 功能描述:晶體管輸出光電耦合器 6-Pin Optocoupler Photodarlington RoHS:否 制造商:Vishay Semiconductors 輸入類型:DC 最大集電極/發(fā)射極電壓:70 V 最大集電極/發(fā)射極飽和電壓:0.4 V 絕緣電壓:5300 Vrms 電流傳遞比:100 % to 200 % 最大正向二極管電壓:1.65 V 最大輸入二極管電流:60 mA 最大集電極電流:100 mA 最大功率耗散:100 mW 最大工作溫度:+ 110 C 最小工作溫度:- 55 C 封裝 / 箱體:DIP-4 封裝:Bulk
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