參數(shù)資料
型號： MMC2075VF001
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： Integrated Processor with Roaming FLEX Decoder
中文描述： MROM, RISC MICROCONTROLLER, PBGA144
封裝： 12 X 12 MM, 0.80 MM PITCH, MOLD ARRAY PROCESS, BGA-144
文件頁數(shù)： 33/34頁
文件大?。?/td> 768K
代理商： MMC2075VF001
Electrical Design Considerations
Design Considerations
Preliminary
33
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple reading
on the case of the package will estimate a junction temperature slightly hotter than the actual temperature.
Hence, the new thermal metric, thermal characterization parameter or
Ψ
JT
, has been defined to be (T
J
- T
T
)/
P
D
. This value gives a better estimate of the junction temperature in natural convection when using the
surface temperature of the package. Remember that surface temperature readings of packages are subject to
significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat
loss to the sensor. The recommended technique is to attach a 40-gauge thermocouple wire and bead to the
top center of the package with thermally conductive epoxy.
NOTE:
Section 3,
“
Specifications,
”
on page 28
of this document contains the
package thermal values for this chip.
5.2 Electrical Design Considerations
WARNING:
This device contains protective circuitry to guard against damage due to
high static voltage or electrical fields. However, normal precautions are
advised to avoid application of any voltages higher than maximum rated
voltages to this high-impedance circuit. Reliability of operation is
enhanced if unused inputs are tied to an appropriate logic voltage level (for
example, either Vss or V
DD
).
Use the following list of recommendations to assure correct operation:
Provide a low-impedance path from the board power supply to each Vdd pin on the MMC2080/
2075 and from the board ground to each Vss pin.
Use at least four 0.1
μ
F bypass capacitors positioned as close as possible to the four sides of the
package to connect the Vdd power source to Vss.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip Vdd and
Vss pins are less than 0.5 inch per capacitor lead.
Use at least a four-layer printed circuit board (PCB) with two inner layers for Vdd and Vss.
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating
capacitance. This is especially critical in systems with higher capacitive loads that could create
higher transient currents in the Vdd and Vss circuits.
All inputs must be terminated (that is, not allowed to float) using CMOS levels.
Take special care to minimize noise levels on the PLL supply pins (both Vdd and Vss).
相關(guān)PDF資料
PDF描述
MMC2080 Integrated Processor with Roaming FLEX Decoder
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MMC2080 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Integrated Processor with Roaming FLEX Decoder
MMC2080VF001 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Integrated Processor with Roaming FLEX Decoder
MMC-2102 制造商:Pan Pacific 功能描述:
MMC2107 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:HCMOS Microcontroller Unit
MMC2107CFCAF33 功能描述:32位微控制器 - MCU 32 Bit 33 MHz RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT
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