參數(shù)資料
型號(hào): ML63189B-XXX
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類(lèi): 微控制器/微處理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC111
封裝: 4.238 X 4.914 MM, DIE-111
文件頁(yè)數(shù): 34/36頁(yè)
文件大?。?/td> 301K
代理商: ML63189B-XXX
Semiconductor
ML63187/63189B
7/35
PAD CONFIGURATION (ML63187)
Pad Layout
Chip size
: 4.238 mm 4.914 mm
Chip thickness
: 350 mm (280 mm: available as required)
Coordinate origin
: center of chip
Pad hole size
: 100 mm 100 mm
Pad size
: 110 mm 110 mm
Minimum pad pitch
: 140 mm
Note: The chip substrate voltage is VSS.
Y
X
27
SEG38
28
SEG39
SEG11 111
29
SEG40
SEG10 110
30
SEG41
SEG9 109
31
SEG42
SEG8 108
32
SEG43
SEG7 107
33
SEG44
SEG6 106
34
SEG45
SEG5 105
35
SEG46
SEG4 104
36
SEG47
SEG3 103
37
SEG48
SEG2 102
38
SEG49
SEG1 101
39
SEG50
SEG0 100
40
SEG51
COM8
99
41
SEG52
COM7
98
42
SEG53
COM6
97
43
SEG54
COM5
96
44
SEG55
COM4
95
45
SEG56
COM3
94
46
SEG57
COM2
93
47
SEG58
COM1
92
48
SEG59
PB.3
91
49
SEG60
PB.2
90
50
SEG61
PB.1
89
SEG30
19
SEG29
18
57
COM13
SEG28
17
58
COM14
SEG27
16
59
COM15
SEG26
15
60
COM16
SEG25
14
61
V
SS
SEG24
13
62
V
DD1
SEG23
12
63
V
DD2
SEG22
11
64
V
DD3
SEG21
10
65
V
DD4
SEG20
9
66
V
DD5
SEG19
8
67
C1
SEG18
7
68
C2
SEG17
6
69
V
DDH
SEG16
5
70
CB1
SEG15
4
71
CB2
SEG14
3
72
V
DD
SEG13
2
73
V
DDL
SEG12
1
74
OSC1
75
OSC0
76
RESET
77
XT1
78
XT0
79
TST1
80
TST2
81
MD
82
MDB
SEG37
26
SEG36
25
SEG35
24
SEG34
23
SEG33
22
SEG32
21
SEG31
20
51
SEG62
PB.0
88
52
SEG63
PE.3
87
53
COM9
PE.2
86
54
COM10
PE.1
85
55
COM11
PE.0
84
56
COM12
VDDI
83
ML63187
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