參數(shù)資料
型號(hào): ML63189B-XXX
廠商: LAPIS SEMICONDUCTOR CO LTD
元件分類(lèi): 微控制器/微處理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC111
封裝: 4.238 X 4.914 MM, DIE-111
文件頁(yè)數(shù): 29/36頁(yè)
文件大?。?/td> 301K
代理商: ML63189B-XXX
Semiconductor
ML63187/63189B
35/35
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP128-P-1420-0.50-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.19 TYP.
Mirror finish
相關(guān)PDF資料
PDF描述
ML63189B-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC111
ML63193-XXXGA 4-BIT, MROM, MICROCONTROLLER, PQFP144
ML63193-XXX 4-BIT, MROM, MICROCONTROLLER, UUC144
ML63295A-XXXGA 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP240
ML63295A-XXXWA 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC212
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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