參數(shù)資料
型號： ML610Q407-NNNTBZ03A
廠商： LAPIS SEMICONDUCTOR CO LTD
元件分類： 微控制器/微處理器
英文描述： RISC MICROCONTROLLER, PQFP100
封裝： 14 X 14MM, 0.50 PITCH, PLASTIC, TQFP-100
文件頁數(shù)： 45/62頁
文件大小： 1994K
代理商： ML610Q407-NNNTBZ03A
ML610Q407/ML610Q408/ML610Q409 User’s Manual
Contents
Contents – 0
Table of Contents
Chapter 1
1.
Overview ........................................................................................................................................................................... 1-1
1.1 Features ........................................................................................................................................................................ 1-1
1.2 Configuration of Functional Blocks ............................................................................................................................. 1-4
1.2.1
Block Diagram of ML610Q407/ML610Q408/ML610Q409.............................................................................. 1-4
1.3
Pins .............................................................................................................................................................................. 1-5
1.3.1
Pin Layout............................................................................................................................................................. 1-5
1.3.1.1
Pin Layout of ML610Q407 TQFP Package ......................................................................................................................... 1-5
1.3.1.2
Pin Layout of ML610Q408 TQFP Package ......................................................................................................................... 1-6
1.3.1.3
Pin Layout of ML610Q409 TQFP Package ......................................................................................................................... 1-7
1.3.1.4
Pin Layout of ML610Q407 Chip.......................................................................................................................................... 1-8
1.3.1.5
Pin Layout of ML610Q408 Chip.......................................................................................................................................... 1-9
1.3.1.6
Pin Layout of ML610Q409 Chip........................................................................................................................................ 1-10
1.3.1.7
Pad Coordinates of ML610Q407/ML610Q408/M610Q409 Chip ...................................................................................... 1-11
1.3.2
List of Pins.......................................................................................................................................................... 1-12
1.3.3
Pin Descriptions.................................................................................................................................................. 1-15
1.3.4
Handling of Unused Pins .................................................................................................................................... 1-19
Chapter 2
2. CPU and Memory Space ...................................................................................................................................................... 2-1
2.1 Overview ...................................................................................................................................................................... 2-1
2.2 Program Memory Space ............................................................................................................................................... 2-1
2.3 Data Memory Space ..................................................................................................................................................... 2-2
2.4 Instruction Length......................................................................................................................................................... 2-3
2.5 Data Type ..................................................................................................................................................................... 2-3
2.6 Description of Registers ............................................................................................................................................... 2-4
2.6.1
List of Registers .................................................................................................................................................... 2-4
2.6.2
Data Segment Register (DSR) .............................................................................................................................. 2-5
Chapter 3
3. Reset Function ...................................................................................................................................................................... 3-1
3.1 Overview ...................................................................................................................................................................... 3-1
3.1.1
Features................................................................................................................................................................. 3-1
3.1.2
Configuration........................................................................................................................................................ 3-1
3.1.3
List of Pins............................................................................................................................................................ 3-1
3.2 Description of Registers ............................................................................................................................................... 3-2
3.2.1
List of Registers .................................................................................................................................................... 3-2
3.2.2
Reset Status Register (RSTAT) ............................................................................................................................. 3-2
3.3 Description of Operation .............................................................................................................................................. 3-3
3.3.1
Operation of System Reset Mode ......................................................................................................................... 3-3
相關(guān)PDF資料
PDF描述
ML610Q408-NNNWA RISC MICROCONTROLLER, UUC88
ML610Q408P-NNNWA RISC MICROCONTROLLER, UUC88
ML610Q407P-NNNTBZ03A RISC MICROCONTROLLER, PQFP100
ML610Q409P-NNNTBZ03A RISC MICROCONTROLLER, PQFP100
ML610Q409P-XXXTBZ03A RISC MICROCONTROLLER, PQFP100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ML610Q407-NNNTBZ03A7 功能描述:MCU 8BIT 16K FLASH 12CH 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:Lapis 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲器容量:4KB（4K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND
ML610Q407P-NNNTB03A7 功能描述:MCU 8BIT 16K FLASH 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:Lapis 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
ML610Q407-PNNNTBZ03A 制造商:ROHM Semiconductor 功能描述:
ML610Q408 REFBOARD 功能描述:BOARD REF ML610Q408/P RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 通用嵌入式開發(fā)板和套件（MCU、DSP、FPGA、CPLD等） 系列:Lapis 產(chǎn)品培訓(xùn)模塊:Blackfin® Processor Core Architecture Overview Blackfin® Device Drivers Blackfin® Optimizations for Performance and Power Consumption Blackfin® System Services 特色產(chǎn)品:Blackfin? BF50x Series Processors 標(biāo)準(zhǔn)包裝:1 系列:Blackfin® 類型:DSP 適用于相關(guān)產(chǎn)品:ADSP-BF548 所含物品:板，軟件，4x4 鍵盤，光學(xué)撥輪，QVGA 觸摸屏 LCD 和 40G 硬盤 配用:ADZS-BFBLUET-EZEXT-ND - EZ-EXTENDER DAUGHTERBOARDADZS-BFLLCD-EZEXT-ND - BOARD EXT LANDSCAP LCD INTERFACE 相關(guān)產(chǎn)品:ADSP-BF542BBCZ-4A-ND - IC DSP 16BIT 400MHZ 400CSBGAADSP-BF544MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF542KBCZ-6A-ND - IC DSP 16BIT 600MHZ 400CSBGAADSP-BF547MBBCZ-5M-ND - IC DSP 16BIT 533MHZ MDDR 400CBGAADSP-BF548BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF547BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF544BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGAADSP-BF542BBCZ-5A-ND - IC DSP 16BIT 533MHZ 400CSBGA
ML610Q408-NNNTBZ03A7 功能描述:MCU 8BIT 16K FLASH 8CH 100-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:Lapis 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA，UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位，LED，POR，PWM，WDT 輸入/輸出數(shù):16 程序存儲器容量:4KB（4K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND
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