參數(shù)資料
型號： MK30DX256ZVMD10
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144
封裝： 13 X 13 MM, MAPBGA-144
文件頁數(shù)： 11/72頁
文件大?。?/td> 1013K
代理商： MK30DX256ZVMD10
5.1.6 EMC radiated emissions operating behaviors
Table 7. EMC radiated emissions operating behaviors
Symbol
Description
Frequency
band (MHz)
Typ.
Unit
Notes
VRE1
Radiated emissions voltage, band 1
0.15–50
TBD
dBμV
1, 2
VRE2
Radiated emissions voltage, band 2
50–150
TBD
dBμV
VRE3
Radiated emissions voltage, band 3
150–500
TBD
dBμV
VRE4
Radiated emissions voltage, band 4
500–1000
TBD
dBμV
VRE_IEC_SAE IEC and SAE level
0.15–1000
TBD
—
2, 3
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
2. VDD = 3 V, TA = 25 °C, fOSC = 12 MHz (crystal), fSYS = 96 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
2. Perform a keyword search for “EMC design.”
5.1.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
Description
Min.
Max.
Unit
CIN_A
Input capacitance: analog pins
—
7
pF
CIN_D
Input capacitance: digital pins
—
7
pF
5.2 Switching specifications
General
K30 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Freescale Semiconductor, Inc.
Preliminary
19
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