參數(shù)資料
型號(hào)： MIC2583R-MBQS TR
廠商： Micrel Inc
文件頁(yè)數(shù)： 22/25頁(yè)
文件大?。?/td> 826K
描述： IC CTRLR HOT SWAP 200MV 16-QSOP
標(biāo)準(zhǔn)包裝： 2,500
類型： 熱交換控制器
應(yīng)用： 通用
內(nèi)部開(kāi)關(guān)： 無(wú)
電源電壓： 2.3 V ~ 13.2 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 16-SSOP（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 16-QSOP
包裝： 帶卷 (TR)
其它名稱： MIC2583R-MBQSTR
MIC2583R-MBQSTR-ND
Micrel, Inc.
MIC2582/MIC2583
 
 
April 2009 
22
M9999-043009-C
 
PCB Layout Considerations
Because of the low values of the sense resistors used
with the MIC2582/83 controllers, special attention to the
layout must be used in order for the devices circuit
breaker function to operate properly. Specifically, the
use of a 4-wire Kelvin connection to accurately measure
the voltage across R
SENSE
 is highly recommended. Kelvin 
sensing is simply a means of making sure that any
voltage drops in the power traces connecting to the
resistors   does   not   get   picked   up   by   the   traces
themselves.   Additionally,   these   Kelvin   connections
should be isolated from all other signal traces to avoid
introducing noise onto these sensitive nodes. Figure 11
illustrates a recommended, single layer layout for the
R
SENSE
, Power MOSFET, timer(s), and feedback network
connections. The feedback network resistor values are
selected   for   a   12V   application.   Many   hot   swap
applications   will   require   load   currents   of   several
amperes. Therefore, the power (V
CC
 and Return) trace 
widths (W) need to be wide enough to allow the current
to flow while the rise in temperature for a given copper
plate (e.g., 1oz. or 2oz.) is kept to a maximum of
10篊~25篊. Also, these traces should be as short as
possible in order to minimize the IR drops between the
input and the load.
Finally, the use of plated-through vias will be needed to
make circuit connections to power and ground planes
when utilizing multi-layer PC boards.
MOSFET and Sense Resistor Vendors
Device types and manufacturer contact information for
power MOSFETs and sense resistors are provided in
Table 4. Some of the recommended MOSFETs include a
metal heat sink on the bottom side of the package. The
recommended trace for the MOSFET Gate of Figure 11
must be redirected when using MOSFETs packaged in
this style. Contact the device manufacturer for package
information.
.
 
 
Figure 11. Recommended PCB Layout for Sense Resistor,
Power MOSFET, and Feedback Network
 
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