參數(shù)資料
型號： MDS108AL
廠商： ZARLINK SEMICONDUCTOR INC
元件分類： 網(wǎng)絡(luò)接口
英文描述： MicroFit 3.0 Header Vert CPI 6 ckt 569
中文描述： DATACOM, LAN SWITCHING CIRCUIT, PQFP208
封裝： 28 X 28 MM, 3.32 MM HEIGHT, PLASTIC, MO-143, QFP-208
文件頁數(shù)： 31/37頁
文件大?。?/td> 308K
代理商： MDS108AL
MDS108
Data Sheet
31
Zarlink Semiconductor Inc.
14.0 Characteristics and Timing
14.1 Absolute Maximum Rating
Storage Temperature
-65
°
C to +150C
Operating Temperature
-40C to +85C
Maximum Junction Temperature
+125C
Supply Voltage VDD with Respect to V
SS
+3.0 V to +3.6 V
Voltage on 5V Tolerant Input Pins
-0.5 V to (VDD +3.3 V)
Voltage on Other Pins
-0.5V to (VDD +0.3 V)
Caution: Stresses above those listed may cause permanent device failure. Functionality at or above these limits is
not implied. Exposure to the absolute Maximum Ratings for extended Ratings for extended periods may affect
device reliability.
14.2 DC Electrical Characteristics
VDD = 3.0V to 3.6V (3.3v +/- 10%) T
AMBIENT
= -40C to +85 C
14.3 Recommended Operating Conditions
Symbol
Parameter Description
Min.
Typ.
Max.
Unit
f
OSC
I
DD
V
OH
V
OL
Frequency of Operation
Supply Current - @ 55 MHz, 8x100M, 100% Full
Duplex Traffic (VDD = 3.3V)
Output High Voltage (CMOS)
Output Low Voltage (CMOS)
Input High Voltage (TTL 5 V tolerant)
50
66
580
80
MHz
mA
2.4
V
V
V
0.4
V
IH
-
TTL
2.0
VDD +
2.0
0.8
10
V
IL
-
TTL
I
IL
Input Low Voltage (TTL 5 V tolerant)
Input Leakage Current (0.1 V < V
IN
< VDD)
(all pins except those with internal pull-up/ pull-
down resistors)
Output Leakage Current (0.1 V < V
OUT
<
VDD)
Input Capacitance
Output Capacitance
I/O Capacitance
Thermal resistance with 0 air flow
Thermal resistance with 1 m/s air flow
Thermal resistance with 2 m/s air flow
Thermal resistance between junction and case
V
μ
A
I
OL
10
μ
A
C
IN
C
OUT
C
I/O
θ
ja
θ
ja
θ
ja
θ
jc
5
5
7
pF
pF
pF
C/W
C/W
C/W
C/W
29.7
28.8
26.8
12.6
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