參數(shù)資料
型號(hào): MCZ33880EG
廠商: 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述: Configurable Octal Serial Switch with Serial Peripheral Interface I/O
中文描述: 配置八路系列開關(guān)串行外設(shè)接口的I / O
文件頁(yè)數(shù): 5/25頁(yè)
文件大小: 341K
代理商: MCZ33880EG
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33880
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
VDD Supply Voltage
(1)
V
DD
-0.3 to 7.0
V
DC
CS, DI, DO, SCLK, IN5, IN6, and EN
(1)
-0.3 to 7.0
V
DC
VPWR Supply Voltage
(1)
V
PWR
-16 to 50
V
DC
Drain 1 – 8
(2)
5.0 mA
I
OUT
0.3 A
-18 to 40
V
DC
Source 1 – 8
(3)
5.0 mA
I
OUT
0.3 A
-28 to 40
V
DC
Output Voltage Clamp Low-Side Drive
(4)
V
OC
40 to 55
V
DC
Output Voltage Clamp High-Side Drive
(4)
V
OC
-15 to -25
V
DC
Output Clamp Energy
(5)
E
CLAMP
50
mJ
ESD Voltage
(6)
Human Body Model
Machine Model
V
ESD1
V
ESD2
±2000
±200
V
Storage Temperature
T
STG
-55 to 150
°
C
Operating Case Temperature
T
C
-40 to 125
°
C
Operating Junction Temperature
T
J
-40 to 150
°
C
Maximum Junction Temperature
-40 to 150
°
C
Power Dissipation (T
A
= 25
°
C)
(7)
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
P
D
1.3
1.7
W
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
R
θ
JA
94
°
C/W
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
R
θ
JA
R
θ
JL
70
18
°
C/W
Peak Package Reflow Temperature During Reflow
(5)
,
(6)
T
PPRT
Note 6
°C
Notes
1.
2.
3.
4.
5.
6.
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150
°
C junction temperature using single non-repetitive pulse method.
ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), and ESD2 testing is performed
in accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
).
Maximum power dissipation with no heatsink used.
7.
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