The analog output pins (V
參數(shù)資料
型號(hào): MCP660T-E/ST
廠商: Microchip Technology
文件頁數(shù): 13/68頁
文件大?。?/td> 0K
描述: IC OPAMP TRIPLE 60MHZ 14TSSOP
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 3
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 32 V/µs
增益帶寬積: 60MHz
電流 - 輸入偏壓: 6pA
電壓 - 輸入偏移: 1800µV
電流 - 電源: 6mA
電流 - 輸出 / 通道: 80mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 5.5 V,±1.25 V ~ 2.75 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 14-TSSOP
包裝: 帶卷 (TR)
MCP660/1/2/3/4/5/9
DS22194D-page 20
2009-2012 Microchip Technology Inc.
3.1
Analog Outputs
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs
The non-inverting and inverting inputs (VIN+, VIN-, …)
are high-impedance CMOS inputs with low bias
currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 2.5V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In that case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Chip Select Digital Input (CS)
The input (CS) is a CMOS, Schmitt-triggered input that
places the part into a Low Power mode of operation.
3.5
Exposed Thermal Pad (EP)
There is an internal connection between the exposed
thermal pad (EP) and the VSS pin; they must be con-
nected to the same potential on the printed circuit
board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (
JA).
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