參數(shù)資料
型號: MCP606-I/SN
廠商: Microchip Technology
文件頁數(shù): 38/42頁
文件大小: 0K
描述: IC OPAMP 2.5V R-R 8SOIC
標準包裝: 100
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉換速率: 0.08 V/µs
增益帶寬積: 155kHz
電流 - 輸入偏壓: 1pA
電壓 - 輸入偏移: 250µV
電流 - 電源: 18.7µA
電流 - 輸出 / 通道: 17mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOICN
包裝: 管件
產(chǎn)品目錄頁面: 678 (CN2011-ZH PDF)
2009 Microchip Technology Inc.
DS11177F-page 5
MCP606/7/8/9
TEMPERATURE CHARACTERISTICS
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-3. The bypass
capacitors are laid out according to the rules discussed
in
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
Electrical Characteristics: Unless otherwise indicated, V
DD = +2.5V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
+85
°C
Operating Temperature Range
TA
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-SOT23
θ
JA
220.7
°C/W
Thermal Resistance, 8L-PDIP
θ
JA
—89.3
°C/W
Thermal Resistance, 8L-SOIC
θ
JA
149.5
°C/W
Thermal Resistance, 8L-TSSOP
θ
JA
139
°C/W
Thermal Resistance, 14L-PDIP
θ
JA
—70
°C/W
Thermal Resistance, 14L-SOIC
θ
JA
—95.3
°C/W
Thermal Resistance, 14L-TSSOP
θ
JA
100
°C/W
Note 1:
The MCP606/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the
Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
VDD
RG
RF
RN
VOUT
VIN
VDD/2
1F
CL
RL
VL
0.1 F
MCP60X
VDD
RG
RF
RN
VOUT
VDD/2
VIN
1F
CL
RL
VL
0.1 F
MCP60X
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