參數(shù)資料
型號: MCP4012T-202E/CH
廠商: Microchip Technology
文件頁數(shù): 47/54頁
文件大?。?/td> 0K
描述: IC DGTL POT 2.1K 1CH RHE SOT23-6
標準包裝: 1
接片: 64
電阻(歐姆): 2.1k
電路數(shù): 1
溫度系數(shù): 標準值 150 ppm/°C
存儲器類型: 易失
接口: 2 線串行(芯片選擇,增/減)
電源電壓: 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應商設備封裝: SOT-23-6
包裝: 標準包裝
產品目錄頁面: 674 (CN2011-ZH PDF)
其它名稱: MCP4012T-202E/CHDKR
2006 Microchip Technology Inc.
DS21978C-page 51
MCP4011/2/3/4
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.50
0.43
0.35
.020
.017
.014
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
10
5
0
10
5
0
φ
Foot Angle
0.55
0.45
0.35
.022
.018
.014
L
Foot Length
3.10
2.95
2.80
.122
.116
.110
D
Overall Length
1.75
1.63
1.50
.069
.064
.059
E1
Molded Package Width
3.00
2.80
2.60
.118
.110
.102
E
Overall Width
0.15
0.08
0.00
.006
.003
.000
A1
Standoff
1.30
1.10
0.90
.051
.043
.035
A2
Molded Package Thickness
1.45
1.18
0.90
.057
.046
.035
A
Overall Height
1.90 BSC
.075 BSC
p1
Outside lead pitch
0.95 BSC
.038 BSC
p
Pitch
6
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
Notes:
JEITA (formerly EIAJ) equivalent: SC-74A
* Controlling Parameter
Drawing No. C04-120
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
Revised 09-12-05
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