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| 型號： | MCP23S18-E/SO |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | PIA-GENERAL PURPOSE, PDSO28 |
| 封裝： | 0.300 INCH, PLASTIC, SOIC-28 |
| 文件頁數(shù)： | 27/56頁 |
| 文件大?。?/td> | 738K |
| 代理商： | MCP23S18-E/SO |
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2008 Microchip Technology Inc.
DS22103A-page 33
MCP23018/MCP23S18
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
Ambient temperature under bias............................................................................................................ .-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.0V
Voltage on RESET with respect to VSS ..................................................................................................... -0.3V to +14V
Voltage on all other pins with respect to VSS (except VDDand GPIOA/B) ...................................... -0.6V to (VDD + 0.6V)
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of VSS pin ...........................................................................................................................400 mA
Maximum current into VDD pin .............................................................................................................................. 125 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
...................................................................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
.............................................................................................................. ±20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (VDD = 1.8V) ..............................................................................10 mA
Maximum output current sourced by any Output pin ..............................................................................................25 mA
Maximum output current sourced by any Output pin (VDD = 1.8V) .........................................................................10 mA
Note:
Power dissipation is calculated as follows:
Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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相關代理商/技術參數(shù) |
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|---|---|
| MCP23S18T | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs |
| MCP23S18T-E/MJ | 功能描述:接口-I/O擴展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| MCP23S18T-E/SO | 功能描述:接口-I/O擴展器 16B I/O Expander SPI interface RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| MCP23S18T-E/SP | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs |
| MCP23S18T-E/SS | 制造商:MICROCHIP 制造商全稱:Microchip Technology 功能描述:16-Bit I/O Expander with Open-Drain Outputs |
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