參數(shù)資料
型號(hào): MCIMX27MJP4A
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 400 MHz, MICROPROCESSOR, PBGA473
封裝: 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473
文件頁數(shù): 93/152頁
文件大?。?/td> 3889K
代理商: MCIMX27MJP4A
i.MX27 and i.MX27L Data Sheet, Rev. 1.6
Freescale Semiconductor
45
Electrical Characteristics
4.2.1.2
AC Electrical Characteristics
Figure 2 depicts the load circuit for output pads. Figure 3 depicts the output pad transition time waveform.
The range of operating conditions appear in Table 14 for slow general I/O, Table 15 for fast general I/O,
and Table 16 for DDR I/O (unless otherwise noted).
Figure 2. Load Circuit for Output Pad
Figure 3. Output Pad Transition Time Waveform
Low-level output current
IOL
VOL=0.2*NVDD_DDR
Normal
High
Max High1
DDR Drive1
3.6
7.2
10.8
14.4
——
mA
Low-level input current
IIL
VI = 0
1.7
2
μA
High-level input current
IIH
VI = NVDD_DDR
—2
μA
Tri-state current
IZ
VI = NVDD_DDR or 0
I/O = high Z
—1.7
2
μA
Note:
1 Max High and DDR Drive strengths should be avoided due to excessive overshoot and ringing.
Table 14. AC Electrical Characteristics of Slow General I/O Pads
ID
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
PA1
Output Pad Transition Times (Max High)
tpr
25 pF
50 pF
1.25
1.95
1.9
2.9
3.2
4.75
ns
Output Pad Transition Times (High)
tpr
25 pF
50 pF
1.45
2.6
—4.8
8.4
ns
Output Pad Transition Times (Standard Drive)
tpr
25 pF
50 pF
2.6
5.1
—8.5
16.5
ns
Maximum Input Transition Times1
trm
25
ns
Note:
Table 13. DDR (Double Data Rate) I/O Pads DC Electrical Parameters (continued)
Parameter
Symbol
Test Conditions
Min
Typical
Max
Units
Test Point
From Output
Under Test
CL
CL includes package, probe and jig capacitance
0 V
NVDD
20%
80%
20%
PA1
Output (at pad)
相關(guān)PDF資料
PDF描述
MCIMX27VOP4A 32-BIT, 400 MHz, MICROPROCESSOR, PBGA404
MCIMX281AVM4B 32-BIT, 454 MHz, RISC PROCESSOR, PBGA289
MCP25020-I/P SPECIALTY MICROPROCESSOR CIRCUIT, PDIP14
MCP25050T-E/SL SPECIALTY MICROPROCESSOR CIRCUIT, PDSO14
MCP25055-I/SL SPECIALTY MICROPROCESSOR CIRCUIT, PDSO14
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCIMX27MJP4AR2 功能描述:處理器 - 專門應(yīng)用 Bono 19x19 FG RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX27MOP4A 功能描述:處理器 - 專門應(yīng)用 BONO 19X19 FG RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX27MOP4AR2 功能描述:處理器 - 專門應(yīng)用 BONO 19X19 R2 RoHS:否 制造商:Freescale Semiconductor 類型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432
MCIMX27PDKCPU 功能描述:開發(fā)板和工具包 - ARM I.MX27 PDK CPU BOARD RoHS:否 制造商:Arduino 產(chǎn)品:Development Boards 工具用于評(píng)估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口類型:DAC, ICSP, JTAG, UART, USB 工作電源電壓:3.3 V
MCIMX27V0P4A 制造商:Rochester Electronics LLC 功能描述: 制造商:Freescale Semiconductor 功能描述: