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參數資料
| 型號： | MCF5327 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | Microprocessor Data Sheet |
| 中文描述： | 微處理器數據表 |
| 文件頁數： | 16/48頁 |
| 文件大?。?/td> | 922K |
| 代理商： | MCF5327 |
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MCF5329 ColdFire
Microprocessor Data Sheet, Rev. 0.1
Preliminary
Preliminary Electrical Characteristics
Freescale Semiconductor
16
5.2
Thermal Characteristics
The average chip-junction temperature (T
J
) in
°
C can be obtained from:
Eqn. 1
Where:
T
A
= Ambient Temperature,
°
C
Q
JMA
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
×
IV
DD
, Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins — User Determined
5
Power supply must maintain regulation within operating EV
DD
range during instantaneous
and operating maximum current conditions. If positive injection current (V
in
> EV
DD
) is greater
than I
DD
, the injection current may flow out of EV
DD
and could result in external power supply
going out of regulation. Insure external EV
DD
load will shunt current greater than maximum
injection current. This will be the greatest risk when the MCU is not consuming power (ex; no
clock). Power supply must maintain regulation within operating EV
DD
range during
instantaneous and operating maximum current conditions.
Table 5. Thermal Characteristics
Characteristic
Symbol
256MBGA
196MBGA
Unit
Junction to ambient, natural convection
Four layer board
(2s2p)
θ
JMA
26
1,2
NOTES:
1
θ
JMA
and
Ψ
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection.
Freescale recommends the use of
θ
JmA
and power dissipation specifications in the system design to prevent
device junction temperatures from exceeding the rated specification. System designers should be aware
that device junction temperatures can be significantly influenced by board layout and surrounding devices.
Conformance to the device junction temperature specification can be verified by physical measurement in
the customer’s system using the
Ψ
jt
parameter, the device power dissipation, and the method described in
EIA/JESD Standard 51-2.
2
Per JEDEC JESD51-6 with the board horizontal.
3
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8.
Board temperature is measured on the top surface of the board near the package.
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
5
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written in conformance with Psi-JT.
32
1,2
°
C / W
Junction to ambient (@200 ft/min)
Four layer board
(2s2p)
θ
JMA
23
1,2
29
1,2
°
C / W
Junction to board
θ
JB
θ
JC
Ψ
jt
15
3
20
3
°
C / W
Junction to case
10
4
10
4
°
C / W
Junction to top of package
2
1,5
2
1,5
°
C / W
Maximum operating junction temperature
T
j
105
105
o
C
T
J
T
A
P
D
Θ
JMA
×
(
)
+
=
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MCF5327CVM240 | 功能描述:微處理器 - MPU MCF5329 V2-CORE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MCF5327CVM240J | 制造商:Freescale Semiconductor 功能描述:MPC5XXX RISC 32-BIT CMOS 240MHZ 196-PIN MA-BGA TRAY - Trays |
| MCF5328 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53281 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor |
| MCF53281CVM240 | 功能描述:微處理器 - MPU MCF5329 DRAGONFIRE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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