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參數(shù)資料
| 型號： | MCF52252AF80 |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, ROHS COMPLIANT, LQFP-100 |
| 文件頁數(shù)： | 21/46頁 |
| 文件大?。?/td> | 560K |
| 代理商： | MCF52252AF80 |
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Electrical Characteristics
MCF52259 ColdFire Microcontroller, Rev. 4
Freescale Semiconductor
28
2.4
Flash Memory Characteristics
16 Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
17 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
18 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
The average chip-junction temperature (TJ) in C can be obtained from:
(1)
Where:
TA
= ambient temperature,
C
JA
= package thermal resistance, junction-to-ambient,
C/W
PD
= PINT PI/O
PINT
= chip internal power, IDD VDD, watts
PI/O
= power dissipation on input and output pins — user determined, watts
For most applications PI/O PINT and can be ignored. An approximate relationship between PD and TJ (if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
K = PD (TA + 273 C) + JMA PD
2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for
any value of TA.
Table 9. SGFM Flash Program and Erase Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Min
Typ
Max
Unit
System clock (read only)
fsys(R)
0—
66.67 or 801
1
Depending on packaging; see the orderable part number summary.
MHz
System clock (program/erase)2
2 Refer to the flash memory section for more information
fsys(P/E)
0.15
—
66.67 or 801
MHz
Table 10. SGFM Flash Module Life Characteristics
(VDD = 3.0 to 3.6 V)
Parameter
Symbol
Value
Unit
Maximum number of guaranteed program/erase cycles1 before failure
1 A program/erase cycle is defined as switching the bits from 1
0 1.
P/E
10,0002
Cycles
Data retention at average operating temperature of 85
C
Retention
10
Years
TJ
TA
PD JMA
+
=
PD
KTJ 273C
+
=
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| MCF5232CAB80 | 32-BIT, 80 MHz, RISC PROCESSOR, PQFP160 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCF52252AF80 | 制造商:Freescale Semiconductor 功能描述:32-bit Microcontroller IC |
| MCF52252CAF66 | 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MCF52252CAF66 | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 66MHZ LQFP-100 |
| MCF52254AF80 | 功能描述:32位微控制器 - MCU KIRIN3 COLDFIRE V2 RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風(fēng)格:SMD/SMT |
| MCF52254AF80 | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU COLDFIRE/68K 80MHZ LQFP-100 |
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