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參數(shù)資料
| 型號： | MC9S08QE64CQD |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PQFP44 |
| 封裝： | 10 X 10 MM, 2 MM, HEIGHT, 0.80 MM PITCH, QFP-44 |
| 文件頁數(shù)： | 5/52頁 |
| 文件大?。?/td> | 834K |
| 代理商： | MC9S08QE64CQD |
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Electrical Characteristics
MC9S08QE128 Series Advance Information Data Sheet, Rev. 3
Freescale Semiconductor
13
3.4
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and it
is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine
the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small.
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD ×θJA)
Eqn. 1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
3 Power supply must maintain regulation within operating V
DD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may ow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
Table 5. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
TL to TH
–40 to 85
°C
Maximum junction temperature
TJM
95
°C
Thermal resistance
Single-layer board
32-pin LQFP
θJA
82
°C/W
44-pin LQFP
69
48-pin QFN
81
64-pin LQFP
θJA
69
°C/W
80-pin LQFP
60
Thermal resistance
Four-layer board
32-pin LQFP
θJA
54
°C/W
44-pin LQFP
47
48-pin QFN
26
64-pin LQFP
θJA
50
°C/W
80-pin LQFP
47
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