參數(shù)資料
型號: MC9S08GW64CLH
廠商: Freescale Semiconductor
文件頁數(shù): 7/42頁
文件大小: 0K
描述: IC MCU 8BIT 64KB FLASH 64 LQFP
標準包裝: 800
系列: S08
核心處理器: S08
芯體尺寸: 8-位
速度: 20MHz
連通性: I²C,LIN,SCI,SPI
外圍設備: LCD,PWM,WDT
輸入/輸出數(shù): 57
程序存儲器容量: 64KB(64K x 8)
程序存儲器類型: 閃存
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉換器: A/D 16x16b
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-LQFP
包裝: 托盤
Electrical Characteristics
MC9S08GW64 Series MCU Data Sheet, Rev. 3
Freescale Semiconductor
15
Figure 4. Non LCD pins I/O Pullup Typical Resistor Values
22
C
Low-voltage
detection
threshold
High range — VDD falling
VLVDH
2.11
2.16
2.22
V
High range — VDD rising
2.16
2.23
2.27
23
C
Low-voltage
detection
threshold
Low range — VDD falling
VLVDL
1.80
1.85
1.91
V
Low range — VDD rising
1.86
1.92
1.99
24
C
Low-voltage
warning
threshold
VDD falling, LVWV = 1
VLVWH
2.36
2.46
2.56
V
VDD rising, LVWV = 1
2.52
2.49
2.71
25
C
Low-voltage
warning
VDD falling, LVWV = 0
VLVWL
2.10
2.16
2.23
V
VDD rising, LVWV = 0
2.15
2.23
2.26
26
C Low-voltage inhibit reset/recover
hysteresis
Vhys
—80—
mV
27
P Bandgap Voltage Reference7
VBG
1.15
1.17
1.19
V
1 Typical values are measured at 25
C. Characterized, not tested
2 Total leakage current is the sum value for all GPIO pins. This leakage current is not distributed evenly across all pins but
characterization data shows that individual pin leakage current maximums are less than 250nA.
3 All functional non-supply pins, except for PTB2 are internally clamped to V
SS and VDD.
4 Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values for positive and negative clamp voltages, then use the larger of the two values.
5 Power supply must maintain regulation within operating V
DD range during instantaneous and operating maximum current
conditions. If the positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD and could
result in external power supply going out of regulation. Ensure that external VDD load will shunt current greater than maximum
injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is
present, or if clock rate is very low (which would reduce overall power consumption).
6 POR will occur below the minimum voltage.
7 Factory trimmed at V
DD = 3.0 V, Temp = 25C
Table 8. DC Characteristics (continued)
Num C
Characteristic
Symbol
Condition
Min
Typ1
Max
Unit
TBD
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