參數(shù)資料
型號： MC8641HX1500KB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
封裝： 33 X 33 MM, CERAMIC, BGA-1023
文件頁數(shù)： 15/130頁
文件大?。?/td> 1493K
代理商： MC8641HX1500KB
MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
111
Thermal
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
19.2.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 71, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 60 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 60. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關(guān)PDF資料
PDF描述
MC8641DHX1250HB 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
MC8641DHX1333JC 32-BIT, 166.66 MHz, MICROPROCESSOR, CBGA1023
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MC8641THX1000G 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications Addendum for the MC8641xTxxnnnnxC Series
MC8641THX1000GC 功能描述:MPU E600 SGL CORE 994-FCCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC86xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應商設備封裝:783-FCPBGA（29x29） 包裝:托盤
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