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參數(shù)資料
| 型號(hào)： | MC8641HX1000JC |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | MICROPROCESSOR, CBGA1023 |
| 封裝： | 33 X 33 MM, CERAMIC, BGA-1023 |
| 文件頁數(shù)： | 29/140頁 |
| 文件大小： | 1484K |
| 代理商： | MC8641HX1000JC |
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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 0
124
Freescale Semiconductor
System Design Information
20.2.2
PLL Power Supply Sequencing
20.3
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the MPC8641 system, and the device
itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system
designer place at least one decoupling capacitor at each OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren,
and VDD_PLAT pin of the device. These decoupling capacitors should receive their power from separate
OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT and GND power planes in the PCB,
utilizing short traces to minimize inductance. Capacitors may be placed directly under the device using a
standard escape pattern. Others may surround the part.
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the OVDD, Dn_GVDD, LVDD, TVDD, VDD_Coren, and VDD_PLAT planes, to enable quick
recharging of the smaller chip capacitors. They should also be connected to the power and ground planes
through two vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum
or Sanyo OSCON).
20.4
SerDes Block Power Supply Decoupling Recommendations
The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD_SRDSn) to ensure
low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is
outlined below.
Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections
from all capacitors to power and ground should be done with multiple vias to further reduce inductance.
First, the board should have at least 10 x 10-nF SMT ceramic chip capacitors as close as possible
to the supply balls of the device. Where the board has blind vias, these capacitors should be placed
directly below the chip supply and ground connections. Where the board does not have blind vias,
these capacitors should be placed in a ring around the device as close to the supply and ground
connections as possible.
Second, there should be a 1-F ceramic chip capacitor on each side of the device. This should be
done for all SerDes supplies.
Third, between the device and any SerDes voltage regulator there should be a 10-F, low
equivalent series resistance (ESR) SMT tantalum chip capacitor and a 100-F, low ESR SMT
tantalum chip capacitor. This should be done for all SerDes supplies.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC8641HX1000K | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641HX1000N | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8641HX1000NB | 功能描述:微處理器 - MPU G8 REV 2.0 0.95V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8641HX1000NC | 功能描述:微處理器 - MPU G8 REV 2.1 0.95V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MC8641HX1000NE | 功能描述:微處理器 - MPU G8 REV 3.0 0.95V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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