參數(shù)資料
型號: MC8640VU1250HC
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
封裝: 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023
文件頁數(shù): 117/130頁
文件大?。?/td> 1495K
代理商: MC8640VU1250HC
MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
87
Package
Random jitter is calibrated using a high pass filter with a low frequency corner at 20 MHz and a 20
dB/decade roll-off below this. The required sinusoidal jitter specified in Section 15.7, “Receiver
Specifications,is then added to the signal and the test load is replaced by the receiver being tested.
16 Package
This section details package parameters and dimensions.
16.1
Package Parameters for the MPC8640
The package parameters are as provided in the following list. The package type is 33 mm
× 33 mm, 1023
pins. There are two package options: high-lead flip chip-ceramic ball grid array (FC-CBGA) and lead-free
(FC-CBGA).
For all package types:
Die size
12.1 mm
× 14.7 mm
Package outline
33 mm
× 33 mm
Interconnects
1023
Pitch
1 mm
Total Capacitor count
43 caps; 100 nF each
For high-lead FC-CBGA (package option: HCTE1 HX)
Maximum module height
2.97 mm
Minimum module height
2.47 mm
Solder Balls
89.5% Pb 10.5% Sn
Ball diameter (typical2)
0.60 mm
For RoHS lead-free FC-CBGA (package option: HCTE1 VU)
Maximum module height
2.77 mm
Minimum module height
2.27 mm
Solder Balls
95.5% Sn 4.0% Ag 0.5% Cu
Ball diameter (typical2)
0.60 mm
1 High-coefficient of thermal expansion
2 Typical ball diameter is before reflow
相關(guān)PDF資料
PDF描述
MC8640HX1250HE 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
MC8640DHX1000HC 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023
MC8640DHX1250HE 32-BIT, 1250 MHz, MICROPROCESSOR, CBGA1023
MC8640DHX1067NC 32-BIT, 1067 MHz, MICROPROCESSOR, CBGA1023
MC8640DTVU1000HE 32-BIT, 1000 MHz, MICROPROCESSOR, CBGA1023
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