參數(shù)資料
型號: MC8610PX800GZ
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: MICROPROCESSOR, PBGA783
封裝: 29 X 29 MM, PLASTIC, FCBGA-783
文件頁數(shù): 84/96頁
文件大小: 1237K
代理商: MC8610PX800GZ
Hardware Design Considerations
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
85
To reduce the die-junction temperature, heat sinks are required; due to the potential large mass of the heat sink, attachment
through the printed-circuit board is suggested. In any implementation of a heat sink solution, the force on the die should not
exceed ten pounds force (45 newtons). Figure 54 shows a spring clip through the board. Occasionally the spring clip is attached
to soldered hooks or to a plastic backing structure. Screw and spring arrangements are also frequently used.
Figure 54. FC-PBGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Suitable heat sinks are commercially available from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
888-732-6100
60 Alhambra Road, Suite 1
Warwick, RI 02886
Internet: www.calgreg.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Thermal
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
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