參數(shù)資料
型號： MC74LCX16240ADTR2
廠商： ON SEMICONDUCTOR
元件分類： 總線收發(fā)器
英文描述： LVC/LCX/Z SERIES, QUAD 4-BIT DRIVER, INVERTED OUTPUT, PDSO48
封裝： PLASTIC, TSSOP-48
文件頁數(shù)： 32/40頁
文件大小： 327K
代理商： MC74LCX16240ADTR2
Reliability Information
MOTOROLA
LCX DATA
BR1339 — REV 3
250
System Considerations
The manner in which an IC package is mounted and
positioned in its surrounding environment will have
significant effects on operating junction temperatures.
These conditions are under the control of the system
designer and are worthy of serious consideration in PC
board layout and system ventilation and airflow.
Forced–air cooling will significantly reduce
ΘJA. Air flow
parallel to the long dimension of the package is generally a
few percent more effective than air flow perpendicular to the
long dimension of the package. In actual board layouts, other
components can provide air flow blocking and flow
turbulence, which may reflect the net reduction of
ΘJA of a
specific component.
External heat sinks applied to an IC package can improve
thermal resistance by increasing heat flow to the ambient
environment. Heat sink performance will vary by size,
material, design, and system air flow. Heat sinks can provide
a substantial improvement.
Package mounting can affect thermal resistance. Surface
mount packages dissipate significant amounts of heat
through the leads. Improving heat flow from package leads to
ambient will decrease thermal resistance.
Metal (copper) traces on PC boards conduct heat away
from the package and dissipate it to the ambient; thus the
larger the trace area the lower the thermal resistance.
Package stand–off has a small effect on ΘJA. Boards with
higher thermal conductivity (ceramic) may show the most
pronounced benefit.
The use of thermally conductive adhesive under SO
packages can lower thermal resistance by providing a
direct heat flow path from the package to board. Naturally
high thermal conductivity board material and/or cool board
temperatures amplify this effect.
High thermal conductive board material will decrease
thermal resistance. A change in board material from epoxy
laminate to ceramic will help reduce thermal resistance.
Conclusion
Thermal management remains a major concern of
producers and users of IC’s. An increase in
ΘJA is the major
trade–off one must accept for package miniaturization. When
the user considers all of the variables that affect the IC
junction temperature, he is then prepared to take maximum
advantage of the tools, materials and data that are available.
References
1. “High Performance ECL Data – ECLinPS and ECLinPS Lite,” Motorola, pp. 4–32.
2. “Thermal Considerations for Advanced Logic Families; AN241,” Philips
Semiconductors
相關(guān)PDF資料
PDF描述
MC74LCX16244DTRG LVC/LCX/Z SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48
MC74LCX16373DTRG LVC/LCX/Z SERIES, DUAL 8-BIT DRIVER, TRUE OUTPUT, PDSO48
MC74LCX16500DTR2 LVC/LCX/Z SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56
MC74LCX16646DTR2 LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56
MC74LCX244MEL LVC/LCX/Z SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC74LCX16240DT 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MC74LCX16240DTR2 功能描述:緩沖器和線路驅(qū)動器 2-36.V CMOS 16-Bit RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
MC74LCX16240DTRG 功能描述:緩沖器和線路驅(qū)動器 LOG CMOS BUFR 16BIT 3ST RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
MC74LCX16244D 制造商:Motorola Inc 功能描述:
MC74LCX16244DT 功能描述:緩沖器和線路驅(qū)動器 2-36.V CMOS 16-Bit RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
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