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參數(shù)資料
| 型號： | MC74LCX16240ADTR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 總線收發(fā)器 |
| 英文描述： | LVC/LCX/Z SERIES, QUAD 4-BIT DRIVER, INVERTED OUTPUT, PDSO48 |
| 封裝： | PLASTIC, TSSOP-48 |
| 文件頁數(shù)： | 28/40頁 |
| 文件大?。?/td> | 327K |
| 代理商： | MC74LCX16240ADTR2 |
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Reliability Information
MOTOROLA
LCX DATA
BR1339 — REV 3
246
Summary Package Information
Package Materials
– 14, 16 and 20 Lead
Hitachi CEL 9200N
– 24 Lead
Shinetsu KMC 184
– 48, 56 Lead
Sumitomo 7351T
Leadframe Material
Copper
Plating
80/20 tin/lead solder plate
Die Attach Epoxy
– 14, 16 and 20 Lead
Sumitomo CRM 1033B
– 24 Lead
Ablestik 84–1 LMISR4
– 48, 56 Lead
Ablestik 8361J
Wire Bond Material
1.0 mil gold
Wire Bond Method
Thermosonic Ball
14–/16–Lead Flag Size
83 x 93 mils
20–Lead Flag Size
83 x 120 and 110 x 120 mils
24–Lead Flag Size
118 x 138 mils
48–Lead Flag Size
118 x 197 mils
56–Lead Flag Size
137 x 177 mils
Reliability Audit Program Summary
The Motorola Logic Reliability Audit Program (RAP) is
designed to monitor the ability of Logic products to exceed
minimum acceptable reliability standards. Mesa Reliability
Engineering has overall responsibility for RAP, including
updating requirements, interpreting results, offshore
administration, and monthly reporting.
Testing
RAP is a system of mechanical, environmental, and
electrical tests performed periodically on randomly selected
samples of standard products. Each sample receives
minimum standard tests covering all wafer fab sites,
assembly sites, and packages. Within each family, devices
are chosen to represent the range of die sizes and functional
complexity.
In addition to standard tests, each package type also
receives special pre–conditioning tests, the frequency of
which is intended to sample every package type and
assembly site once per month.
Reliability tests are run at three sites: Mesa, Arizona
(LICD); Manila, Philippines (MPI); and Taipei, Taiwan
(METL). Following mechanical and electrical testing, devices
receive standard static and functional electrical tests using
conditions and limits per applicable device specifications.
Failures
All failed devices require recorded data. Failure data and
failure verification information accompany all rejects to a
product analysis lab where root cause failure analysis is
performed on all occurrences observed at that site. All
information regarding failed units is logged into a tracking
database.
A review is called if any sample has a failure. The findings
are analyzed relative to past performance to determine if
customers are at risk for abnormally high failure rates.
Customer notification may then be required and, if needed, is
prepared and distributed. Following the completion of testing
and data review, the local reliability engineering group enters
all data into the Reliability Audit Program Database.
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| MC74LCX16373DTRG | LVC/LCX/Z SERIES, DUAL 8-BIT DRIVER, TRUE OUTPUT, PDSO48 |
| MC74LCX16500DTR2 | LVC/LCX/Z SERIES, 18-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56 |
| MC74LCX16646DTR2 | LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56 |
| MC74LCX244MEL | LVC/LCX/Z SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74LCX16240DT | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| MC74LCX16240DTR2 | 功能描述:緩沖器和線路驅(qū)動器 2-36.V CMOS 16-Bit RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74LCX16240DTRG | 功能描述:緩沖器和線路驅(qū)動器 LOG CMOS BUFR 16BIT 3ST RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74LCX16244D | 制造商:Motorola Inc 功能描述: |
| MC74LCX16244DT | 功能描述:緩沖器和線路驅(qū)動器 2-36.V CMOS 16-Bit RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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