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參數(shù)資料
型號(hào): MC74HC4060ADR2G
廠商: ON Semiconductor
文件頁數(shù): 3/13頁
文件大小: 0K
描述: IC COUNTER OSC 14STAGE 16SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74HC
邏輯類型: 二進(jìn)制計(jì)數(shù)器
方向:
元件數(shù): 1
每個(gè)元件的位元數(shù): 14
復(fù)位: 異步
計(jì)數(shù)速率: 50MHz
觸發(fā)器類型: 負(fù)邊沿
電源電壓: 2 V ~ 6 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: MC74HC4060ADR2GOSDKR
MC74HC4060A
http://onsemi.com
11
PACKAGE DIMENSIONS
PDIP16
CASE 64808
ISSUE U
SCALE 1:1
18
16
9
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C SEATING
PLANE
0.010
CA
SIDE VIEW
M
16X
D1
e
A2
NOTE 3
M
B M
eB
E
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.735
0.775
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
18.67
19.69
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
c
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
NOTE 6
M
e/2
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