參數(shù)資料
型號(hào): MC74HC373AFELG
廠商: ON Semiconductor
文件頁(yè)數(shù): 7/9頁(yè)
文件大小: 0K
描述: IC LATCH TRANSP OCT 3ST 20SOEIAJ
產(chǎn)品變化通告: 1Q2012 Discontinuation 30/Mar/2012
標(biāo)準(zhǔn)包裝: 2,000
系列: 74HC
邏輯類型: D 型透明鎖存器
電路: 8:8
輸出類型: 三態(tài)
電源電壓: 2 V ~ 6 V
獨(dú)立電路: 1
延遲時(shí)間 - 傳輸: 21ns
輸出電流高,低: 7.8mA,7.8mA
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.209",5.30mm 寬)
供應(yīng)商設(shè)備封裝: SOEIAJ-20
包裝: 帶卷 (TR)
MC74HC373A
http://onsemi.com
7
PACKAGE DIMENSIONS
PDIP20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 73803
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J 20 PL
M
B
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
25.66
27.17
1.010
1.070
B
6.10
6.60
0.240
0.260
C
3.81
4.57
0.150
0.180
D
0.39
0.55
0.015
0.022
G
2.54 BSC
0.100 BSC
J
0.21
0.38
0.008
0.015
K
2.80
3.55
0.110
0.140
L
7.62 BSC
0.300 BSC
M
0
15
0
15
N
0.51
1.01
0.020
0.040
__
E
1.27
1.77
0.050
0.070
1
11
10
20
A
SEATING
PLANE
K
N
F
G
D 20 PL
T
M
A
M
0.25 (0.010)
T
E
B
C
F
1.27 BSC
0.050 BSC
SOIC20
DW SUFFIX
CASE 751D05
ISSUE G
20
1
11
10
B
20X
H
10X
C
L
18X
A1
A
SEATING
PLANE
q
h
X
45
_
E
D
M
0.25
M
B
M
0.25
S
A
S
B
T
e
T
B
A
DIM
MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D
12.65
12.95
E
7.40
7.60
e
1.27 BSC
H
10.05
10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
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