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參數(shù)資料
| 型號： | MC74HC365AN |
| 廠商： | MOTOROLA INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | Hex 3-State Noninverting Buffer with Common Enables |
| 中文描述： | HC/UH SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDIP16 |
| 封裝： | PLASTIC, DIP-16 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 198K |
| 代理商： | MC74HC365AN |
MC54/74HC365
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
19.05
6.10
—
0.39
1.27 BSC
1.40
2.54 BSC
0.21
3.18
7.62 BSC
19.93
7.49
5.08
0.50
1.65
0.38
4.31
0
°
0.51
15
°
1.01
MIN
0.750
0.240
—
0.015
0.050 BSC
MIN
MAX
0.785
0.295
0.200
0.020
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
0.055
0.100 BSC
0.008
0.125
0.300 0.170
0
°
0.020
0.065
0.015
15
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
1
8
9
16
–A
–
–B
–
C
K
N
G
E
F
D
16 PL
–T
PLANE
SEATING
M
L
J
16 PL
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
MIN
0.740
0.250
0.145
0.015
0.040
MIN
18.80
6.35
3.69
0.39
1.02
MAX
0.770
0.270
0.175
0.021
0.070
MAX
19.55
6.85
4.44
0.53
1.77
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
0.21
2.80
7.50
0
°
0.51
0.38
3.30
7.74
10
°
1.01
0.008
0.110
0.295
0
°
0.020
0.015
0.130
0.305
10
°
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
–A
–
B
1
8
9
16
F
H
G
D
16 PL
0.25 (0.010)
M
S
C
–T
–
SEATING
PLANE
K
J
M
L
T
A
M
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC74HC365DT | Hex 3-State Noninverting Buffer with Common Enables |
| MC74HC365N | Hex 3-State Noninverting Buffer with Common Enables |
| MC74HC366 | Hex 3-State Inverting Buffer with Common Enables |
| MC74HC366AD | Hex 3-State Inverting Buffer with Common Enables |
| MC74HC366ADT | Hex 3-State Inverting Buffer with Common Enables |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74HC365N | 制造商:Motorola Inc 功能描述: 制造商:Texas Instruments 功能描述: |
| MC74HC367ADG | 功能描述:緩沖器和線路驅(qū)動器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74HC367ADR2G | 功能描述:緩沖器和線路驅(qū)動器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74HC367ADT | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| MC74HC367ADTG | 功能描述:緩沖器和線路驅(qū)動器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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