24
MPC7455 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
L
3_C
L
K
to
hi
gh
im
ped
anc
e:
All
o
the
rou
tput
s
t L3
CHO
Z
—t
L3_
CLK
/4
+
2
.0
—t
L3_
CLK
/4
+
2
.0
t L3_
CLK
/4
+
2
.0
—t
L3
_CLK
/4
+
2
.0
—n
s
No
te
s
:
1
.
R
ise
an
d
fa
ll
tim
e
s
for
the
L3_
C
L
K
o
u
tp
ut
a
re
m
e
a
s
ure
d
f
rom
20%
to
80
%
of
G
V
DD
.
2
.
Fo
rDDR,
a
lli
n
p
u
t
s
p
e
c
if
ic
a
ti
o
n
s
a
re
me
a
s
u
re
d
f
ro
m
th
e
m
id
p
o
in
to
f
th
e
s
ig
n
a
li
n
q
u
e
s
ti
o
n
to
th
e
mi
d
p
o
in
tvo
lt
a
g
e
o
f
th
e
ri
s
ing
or
fall
in
g
ed
ge
of
t
he
i
n
p
u
t
L3_
EC
H
O
_
C
LK
n
(s
e
Fi
gure
1
0
).
In
put
tim
ing
s
are
mea
s
u
red
at
t
he
p
in
s
.
3
.
Fo
rDDR,
th
e
i
n
p
u
t
d
a
ta
wi
ll
ty
p
ica
lly
f
o
llo
w
th
e
d
g
e
o
fL
3
_
ECHO_
C
L
K
n
as
s
how
n
in
Fig
u
re
10
.Fo
rco
ns
is
tenc
y
w
ith
oth
e
r
inp
u
ts
e
tu
p
t
im
e
s
pec
if
ic
atio
ns
,th
is
w
ill
be
trea
ted
as
neg
ati
v
e
in
put
se
tup
tim
e
.
4.
t L
3_CL
K
/4
is
on
e-fo
urth
the
pe
riod
of
L3_
C
L
K
n
.Thi
s
p
a
ra
me
ter
i
ndi
ca
tes
tha
tth
e
M
P
C
745
5
c
a
n
la
tch
an
inp
u
ts
ig
nal
tha
ti
s
v
a
lid
f
o
ro
n
ly
a
s
h
o
rt
ti
me
be
fore
and
a
s
hort
tim
e
a
fte
rthe
mi
dp
oin
tbe
tw
ee
n
th
e
ri
sin
g
a
nd
fal
lin
g
(o
rfal
lin
g
a
nd
ris
ing
)ed
ges
of
L3_
EC
H
O
_
C
LK
n
at
a
n
y
freq
uen
cy
.
5
.
Al
l
o
u
tp
u
tsp
e
c
if
ic
a
ti
o
n
s
a
re
me
a
s
u
re
d
fro
m
th
e
m
id
p
o
in
tv
o
lt
a
g
e
o
fth
e
ri
s
in
g
(o
rfo
rDDR
wri
te
d
a
ta
,a
lso
th
e
fa
lli
n
g
)e
d
g
e
of
L3_
C
L
K
to
the
mi
dp
oin
tof
the
sig
n
a
lin
qu
es
tio
n
.Th
e
o
u
tp
ut
t
imi
ng
s
a
re
m
e
a
s
ur
ed
a
tth
e
p
ins
.Al
lo
u
tpu
tti
mi
ngs
as
s
u
m
e
a
pure
ly
res
is
tiv
e
5
0
-
l
oad
(s
ee
F
igu
re
8
).
6
.
Fo
rDDR,
th
e
o
u
tp
u
t
d
a
ta
wi
lltyp
ic
a
lly
l
e
a
d
th
e
d
g
e
o
fL
3
_
C
L
K
n
as
s
how
n
in
Fig
u
re
10.
For
con
s
is
te
nc
y
w
ith
o
the
rou
tpu
tva
lid
ti
me
sp
ec
ifi
c
at
ion
s
,
thi
s
w
ill
b
e
trea
ted
as
neg
ati
v
e
out
put
va
lid
tim
e
.
7.
t L
3_CL
K
/4
is
o
ne-fo
urth
the
pe
rio
d
of
L3_
C
L
K
n
.Thi
s
p
a
ra
me
ter
i
n
d
ica
tes
th
at
t
he
s
p
e
c
if
ie
d
ou
tpu
ts
ign
al
is
ac
tual
ly
la
unc
he
d
b
y
a
n
i
n
tern
al
cl
oc
k
d
e
la
ye
d
i
n
pha
se
by
90
°.
The
refo
re,
ther
e
is
a
freq
uen
cy
c
o
m
pon
ent
to
t
he
o
u
tp
ut
v
a
lid
and
ou
tput
ho
ld
t
im
e
s
su
ch
tha
tthe
s
pec
ifi
ed
outp
u
t
s
ign
al
w
ill
be
va
lid
fo
r
app
rox
im
a
tel
y
one
L3
_C
LK
p
e
ri
od
s
ta
rtin
g
th
ree-f
ourt
h
s
of
a
cl
oc
k
p
rio
rto
the
edg
e
o
n
w
h
ic
h
the
SR
AM
w
ill
sa
mp
le
it
a
n
d
end
ing
on
e-fo
urth
of
a
c
loc
k
peri
od
afte
rthe
ed
ge
it
w
ill
b
e
s
a
m
p
led.
8
.Th
es
e
c
onf
igu
rati
on
bit
s
a
llo
w
the
AC
ti
mi
ng
o
fth
e
L
3
in
terf
ace
to
be
alt
e
red
vi
a
s
o
ft
w
a
re.
L3O
H
0
=
L
2
C
R
[12]
,L3
0H
1
=
L3
C
R
[12]
.R
e
v
is
ion
s
o
fth
e
M
P
C
7
4
55
not
des
cri
b
e
d
by
th
is
do
cum
e
n
tm
a
y
im
pl
em
ent
thes
e
bit
s
d
if
fe
ren
tly
.See
Sec
tio
n
1
.1
1.1,
“
P
art
N
u
m
bers
Fu
lly
Ad
dres
se
d
b
y
T
h
is
D
oc
um
en
t,”
a
nd
Sec
tion
1
.1
1
.2,
“
P
art
N
u
mb
ers
N
o
tFull
y
Addre
s
e
d
by
Thi
s
D
o
cu
me
nt,”
for
m
o
re
in
form
ati
o
n
on
w
h
ic
h
d
e
v
ic
e
s
are
add
res
s
e
d
by
th
is
doc
um
en
t.
T
a
ble
1
2
.
L
3
Bus
I
n
te
rf
a
c
e
AC
T
iming
S
p
e
c
ific
a
tions
f
o
rM
S
UG2
(c
ontinue
d)
A
t
recom
m
ended
operat
ing
c
ondit
ions.
S
ee
T
able
4
.
Pa
rame
ter
S
y
m
bo
l
A
ll
Spee
d
G
rade
s
8
Unit
Note
s
L
3
O
H
0
=
0,
L
3
O
H
1
=
0
L
3
O
H
0
=
0
,L3O
H
1
=1
L
3
O
H
0
=
1,
L3
O
H
1
=
0
L
3O
H
0
=
1,
L3
O
H
1
=
1
Min
M
ax
Min
M
ax
Min
M
ax
Min
M
a
x
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.