參數(shù)資料
型號(hào)： MC7447AVU867NB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360
文件頁(yè)數(shù)： 40/58頁(yè)
文件大?。?/td> 1095K
代理商： MC7447AVU867NB
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor
45
System Design Information
9.8.1
Internal Package Conduction Resistance
For the exposed-die packaging technology described in Table 5, the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case thermal resistance (the case is actually the top of the exposed silicon die)
The die junction-to-board thermal resistance
Figure 22 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 22. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink attach
material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be neglected
for a first-order analysis. Thus the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.
9.8.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, Figure 23 shows the thermal performance of three thin-sheet thermal interface materials
(silicone, graphite/oil, fluoroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 20). Therefore, synthetic grease offers the best thermal performance, considering the low
interface pressure, and is recommended due to the high power dissipation of the MPC7447A. Of course,
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
相關(guān)PDF資料
PDF描述
MC7447ATHX867NB 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
MC7447AVS867NB 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
MC7447AVU1000NB 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
MC7447RX1000NBR2 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
MC7447RX1267LB 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7447RX1000LB 制造商:Motorola Inc 功能描述:
MC7447RX1000NB 制造商:Freescale Semiconductor 功能描述:IC, 32BIT MPU, 1000MHZ, BGA-360, Series:(Power) HOST MPU, Core Size:32bit, Progr
MC7447RX600NB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB
MC7447RX733NB 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述:
MC7447RX867NB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*