- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45249 > MC7447AVU867NB (FREESCALE SEMICONDUCTOR INC) 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360 PDF資料下載
參數(shù)資料
| 型號： | MC7447AVU867NB |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 |
| 文件頁數(shù)： | 4/58頁 |
| 文件大?。?/td> | 1095K |
| 代理商： | MC7447AVU867NB |
第1頁第2頁第3頁當前第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
12
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 6 provides the DC electrical characteristics for the MPC7447A.
Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board
RθJMA
16
°C/W
2, 4
Junction-to-board thermal resistance
RθJB
10
°C/W
5
Junction-to-case thermal resistance
RθJC
< 0.1
°C/W
6
Notes:
1. Refer to Section 9.8, “Thermal Management Information,” for details about thermal management.
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
6. This is the thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.
Table 6. DC Electrical Specifications
At recommended operating conditions. See Table 4.
Characteristic
Nominal
Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage
(all inputs)
1.8
VIH
OVDD × 0.65
OVDD + 0.3
V
2
2.5
1.7
OVDD + 0.3
Input low voltage
(all inputs)
1.8
VIL
–0.3
OVDD × 0.35
V
2, 6
2.5
–0.3
0.7
Input leakage current,
Vin = OVDD
Vin = GND
—Iin
—
30
– 30
A
2, 3
High-impedance (off-state) leakage current,
Vin = OVDD
Vin = GND
—ITSI
—
30
– 30
A
2, 3, 4
Output high voltage @ IOH = –5 mA
1.8
VOH
OVDD – 0.45
—
V
2.5
1.8
—
Output low voltage @ IOL = 5 mA
1.8
VOL
—0.45
V
2.5
—
0.6
Table 5. Package Thermal Characteristics1 (continued)
Characteristic
Symbol
Value
Unit
Notes
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC7447ATHX867NB | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360 |
| MC7447AVS867NB | 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360 |
| MC7447AVU1000NB | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360 |
| MC7447RX1000NBR2 | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360 |
| MC7447RX1267LB | 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC7447RX1000LB | 制造商:Motorola Inc 功能描述: |
| MC7447RX1000NB | 制造商:Freescale Semiconductor 功能描述:IC, 32BIT MPU, 1000MHZ, BGA-360, Series:(Power) HOST MPU, Core Size:32bit, Progr |
| MC7447RX600NB | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB |
| MC7447RX733NB | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述: |
| MC7447RX867NB | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB |
發(fā)布緊急采購，3分鐘左右您將得到回復。