參數資料
型號： MC7445ARX867LF
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數： 21/68頁
文件大?。?/td> 1609K
代理商： MC7445ARX867LF
28
MPC7455 RISC Microprocessor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
L
3_C
L
K
to
hig
h
im
pe
da
nce
:Al
l
o
ther
out
put
s
t L3
CHO
Z
—2
.0
—2
.0
—2
.0
—2
.0
n
s
5
Note
s
:
1
.
R
ise
and
fa
llt
im
e
s
for
t
he
L3_
C
L
K
ou
tpu
tar
e
m
eas
ure
d
fro
m
20%
to
80%
of
GV
DD
.
2
.
Al
li
npu
ts
pec
if
ica
tio
ns
are
me
as
ured
fro
m
th
e
m
id
poi
nt
of
th
e
s
ig
nal
in
que
st
ion
to
the
mi
dpo
int
vo
lt
a
ge
o
fth
e
ri
si
ng
edg
e
of
the
in
put
L3_
EC
H
O
_
C
LK
n
(s
e
F
igu
re
1
0
).
I
npu
tti
mi
ngs
are
m
eas
ure
d
at
the
pi
ns
.
3
.
Al
l
out
put
s
pec
ifi
c
a
tio
ns
a
re
mea
s
u
red
fro
m
the
m
id
poi
nt
vo
lt
a
ge
of
th
e
ris
ing
e
dge
o
fL
3_C
L
K
n
to
the
m
id
poi
nt
of
th
e
s
ig
nal
in
que
st
ion
.
T
he
ou
tpu
t
ti
mi
ng
s
are
m
e
a
s
u
red
at
th
e
p
ins
.Al
lo
u
tp
ut
ti
mi
ng
s
a
s
u
m
e
a
pur
ely
res
is
tiv
e
5
0
-
lo
ad
(
s
e
F
igu
re
10
).
4.
t L
3_C
LK
/4
is
on
e-fo
urth
the
pe
riod
of
L3_
C
L
K
n
.Thi
s
p
a
ra
me
ter
i
ndi
ca
tes
tha
tth
e
s
p
e
c
if
ied
ou
tput
si
gna
li
s
a
c
tual
ly
lau
n
c
hed
by
an
in
tern
al
clo
c
k
de
la
yed
in
p
has
e
by
90°.
The
refo
re,
t
here
is
a
frequ
en
cy
co
mp
one
nt
t
o
th
e
o
u
tp
ut
v
a
lid
a
nd
out
put
hol
d
ti
me
s
u
c
h
t
hat
the
sp
ec
ifi
ed
o
u
tp
u
ts
ig
nal
wil
lb
e
v
a
lid
fo
r
a
ppr
oxi
m
a
tel
y
o
ne
L3_
C
L
K
p
e
rio
d
s
tart
ing
thre
e-fo
urth
s
o
fa
cl
oc
k
p
rior
to
t
he
e
d
g
e
on
w
h
ic
h
the
SR
AM
w
ill
sa
mp
le
it
a
nd
end
ing
on
e-fo
urth
of
a
cl
oc
k
p
e
ri
od
a
fter
the
edg
e
i
twil
lb
e
s
a
m
p
le
d.
5
.
T
imi
ng
beh
av
ior
and
ch
ara
c
te
riz
a
tio
n
a
re
c
u
rre
ntl
y
b
e
in
g
e
v
a
lua
ted
.
6
.Th
ese
c
onfi
gur
atio
n
b
it
s
al
low
the
AC
tim
in
g
o
fthe
L3
in
terfa
c
e
to
be
a
lte
red
vi
a
s
o
ftw
a
re.
L
3
O
H
0
=
L2
C
R
[12],
L30
H
1
=
L3C
R
[1
2
].
R
e
visi
on
s
o
fth
e
M
P
C
745
5
n
o
td
e
s
c
ri
bed
by
th
is
doc
um
en
tm
a
y
im
ple
m
e
n
tt
hes
e
b
it
s
di
ff
e
ren
tly
.
See
Sec
tion
1
.1
1
.1,
“Part
N
u
mb
ers
Fu
lly
Add
res
se
d
b
y
Th
is
D
oc
um
ent
,”
an
d
Se
ct
ion
1
.1
1
.2,
“Part
N
u
mb
ers
N
o
tF
u
lly
Ad
dre
s
ed
by
Thi
s
D
o
cu
me
nt,”
f
o
rm
o
re
in
form
ati
on
w
h
ic
h
d
e
vi
ce
s
a
re
a
ddr
ess
e
d
by
thi
s
doc
um
en
t.
T
a
ble
1
3
.
L
3
Bus
I
n
te
rf
a
c
e
AC
T
iming
S
p
e
c
ific
a
tions
f
o
rP
B
2
a
nd
La
te
W
rite
S
RAM
s
(c
ontinue
d)
A
t
recom
m
ended
operat
ing
c
ondit
ions.
S
ee
T
able
4
.
Pa
rame
ter
S
y
m
bo
l
A
ll
Spee
d
G
rade
s
6
Unit
Note
s
L
3
O
H
0
=
0,
L
3
O
H
1
=
0
L
3
O
H
0
=
0
,L3O
H
1
=1
L
3
O
H
0
=
1,
L3
O
H
1
=
0
L
3O
H
0
=
1,
L3
O
H
1
=
1
Min
M
ax
Min
M
ax
Min
M
ax
Min
M
a
x
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
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