參數(shù)資料
型號： MC7445ARX733LF
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 733 MHz, RISC PROCESSOR, CBGA360
封裝： 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù)： 57/68頁
文件大?。?/td> 1609K
代理商： MC7445ARX733LF
60
MPC7455 RISC Microprocessor Hardware Specifications
MOTOROLA
Document Revision History
1.10 Document Revision History
Table 20 provides a revision history for this hardware specification.
Table 20. Document Revision History
Rev. No.
Substantive Change(s)
0
Initial release.
1
Updated for Rev F devices; information specific to Rev C devices is now documented in a separate part
number specifications; see Section 1.11.2 for more information.
Removed 600 and 800 MHz speed grades.
Increased leakage current specifications in Table 6 from 10 to 30 A.
Changed core voltage to 1.3 V; all instances of VDD and AVDD updated.
Updated power consumption specifications in Table 7.
Reduced I/O power guidance in Table 7 from <20% to <5%.
Added footnote 1 to Figures 9 and 11.
Removed CI and WT from Input Setup and Input Hold lists in Table 10; these are output-only signals.
Removed INT, HRESET, MCP, SRESET, and SMI from Input Setup and Input Hold lists in Table 10;
these are asynchronous inputs.
Added TT[0:3] to Input Setup, Input Hold, Output Valid, and Output Hold lists in Table 10; these were
mistakenly omitted in Rev 0.
Updated Tables 13 and 14 to reflect new L3 AC timing in Rev F devices.
Corrected Note 10 in Tables 16 and 17; this is an event pin, not an enable pin.
Corrected entries for L3_ECHO_CLK[1,3] in Table 17; these are I/O pins, not input-only.
Added Note 16 to Table 17; all No Connect pins must be left unconnected.
Changed name of PLL_EXT to PLL_CFG[4] and updated all instances.
Updated Table 18 to reflect PLL configuration settings for Rev F devices.
Added dimensions D2 and E3 to Figure 20.
Transposed dimensions D4 and E4 in Figure 21 (dimensions were reversed).
Revised Figure 24 and Section 1.9.7.
Revised format of Section 1.11.2 and added Tables 23 through 26.
Revised Section 1.9.8.3 and added additional thermal modeling information, including Figure 28.
Changed maximum heat sink clip spring force in Section 1.9.8, from 5.5 lbs to 10 lbs.
Changed substrate marking for MPC7445 in Figure 29; all MPC744x device substrates are marked
MPC7440.
Changed substrate marking for MPC7455 in Figure 29; all MPC745x device substrates are marked
MPC7450.
1.1
Removed reference to Note 4 for DTI signals in Tables 15 and 16: these signals are unused in 60x bus
mode and must be pulled down (see Note 13); they are not ignored.
Improved precision of die and package dimensions in Figures 20 and 21.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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