Table of Contents
MC68HC05C8A
—
Rev. 3.0
General Release Specification
MOTOROLA
Table of Contents
9
L
G
R
Section 13. Electrical Specifications
Contents .................................................................................113
Introduction.............................................................................113
Maximum Ratings...................................................................114
Operating Temperature Range...............................................115
Thermal Characteristics..........................................................115
Power Considerations.............................................................116
5.0 V DC Electrical Characteristics.........................................118
3.3 V DC Electrical Characteristics.........................................119
5.0 V Control Timing...............................................................122
13.10 3.3 V Control Timing...............................................................123
13.11 5.0 V Serial Peripheral Interface Timing.................................126
13.12 3.3 V Serial Peripheral Interface Timing.................................127
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
Section 14. Mechanical Specifications
Contents .................................................................................131
Introduction.............................................................................131
40-Pin Plastic Dual In-Line (DIP) Package
(Case 711-03)....................................................................132
42-Pin Plastic Shrink Dual In-Line (SDIP) Package
(Case 858-01)....................................................................132
44-Lead Plastic Leaded Chip Carrier (PLCC)
(Case 777-02)....................................................................133
44-Lead Quad Flat Pack (QFP)
(Case 824A-01) .................................................................134
14.1
14.2
14.3
14.4
14.5
14.6
Section 15. Ordering Information
Contents .................................................................................135
Introduction.............................................................................135
MCU Ordering Forms .............................................................135
Application Program Media.....................................................136
ROM Program Verification......................................................137
ROM Verification Units (RVUs)...............................................138
MC Order Numbers ................................................................139
15.1
15.2
15.3
15.4
15.5
15.6
15.7